935142521410-W0T中文资料村田数据手册PDF规格书

• Compatible with MLCC footprint

• Ultra-high stability of capacitance value:

• Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to

+150 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through

ageing

• Low profile 250µm or 100µm

• Small size 0.5 x 0.5 mm (0202 format)

• Break down voltage : 150V

• Low leakage current

• High reliability

• High operating temperature

(up to 150 °C)

• Compatible with high temperature

cycling during manufacturing

operations (exceeding 300 °C)

• Compatible with EIA 0202 footprint

• Applicable for standard wire bonding assembly (ball and wedge)