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88W8987-A2-NYEE/AK中文资料PDF规格书

88W8987-A2-NYEE/AK
厂商型号

88W8987-A2-NYEE/AK

功能描述

2.4/5 GHz Dual-band 1x1 Wi-Fi 5 (802.11ac) and Bluetooth 5.2 Solution

文件大小

1.06919 Mbytes

页面数量

89

生产厂商 NXP Semiconductors
企业简称

nxp恩智浦

中文名称

恩智浦半导体公司官网

原厂标识
数据手册

下载地址一下载地址二原厂数据手册到原厂下载

更新时间

2024-6-6 17:23:00

88W8987-A2-NYEE/AK规格书详情

The 88W8987 is a highly integrated Wi-Fi (2.4/5 GHz) and Bluetooth single-chip solution,

specifically designed to support the speed, reliability, and quality requirements of next

generation Very High Throughput (VHT) products.

The System-on-Chip (SoC) provides both simultaneous and independent operation of the

following:

• IEEE 802.11ac (Wave 2), 1x1 with data rates up to MCS9 (433 Mbit/s)

• Bluetooth 5.2 (includes Bluetooth Low Energy (LE))

The SoC also provides:

• Bluetooth Classic and Bluetooth LE dual (Smart Ready) operation

• Wi-Fi indoor location positioning (802.11mc)

For security, the device supports high performance 802.11i security standards through

implementation of the Advanced Encryption Standard (AES)/Counter Mode CBCMAC

Protocol (CCMP), AES/Galois/Counter Mode Protocol (GCMP), AES/Cipher-

Based Message Authentication Code (CMAC), and WLAN Authentication and Privacy

Infrastructure (WAPI) security mechanisms.

For video, voice, and multimedia applications, 802.11e Quality of Service (QoS) is

supported. The device also supports 802.11h Dynamic Frequency Selection (DFS) for

detecting radar pulses when operating in the 5 GHz range.

Host interfaces include SDIO 3.0 and high-speed UART interfaces for connecting Wi-Fi

and Bluetooth technologies to the host processor.

The device is designed with two front-end configurations to accommodate Wi-Fi and

Bluetooth on either separate or shared paths:

• 2-antenna configuration—1x1 Wi-Fi and Bluetooth on separate paths (QFN)

• 1-antenna configuration—1x1 Wi-Fi and Bluetooth on shared paths (eWLP)

The following figures show the application diagrams for each package option.

General features

• Package options

– 68-pin 8x8 mm QFN with wettable flanks

– 83-bump 4.6x4.2 mm eWLP

• Power management

– Low power dissipation

– Optional lower power operation with external sleep clock

– Sleep and standby modes for low-power operation

• Independent ARM-based Wi-Fi and Bluetooth CPUs

• Supports reference clock signal from external crystal or external crystal oscillator

• Memory

– Internal SRAM

– Boot ROM

– One Time Programmable (OTP) memory to store the MAC address and calibration

data

• Peripheral interfaces

– GPIO interface (up to 21)

Applications

• Wi-Fi and Bluetooth enabled smart phones and tablets

• Personal computing systems including notebooks and ultrabooks

• Wireless home audio and video entertainment systems

• Mobile routers and Internet of Things (IoT) gateways

供应商 型号 品牌 批号 封装 库存 备注 价格
Marvell
21+
BGA
94
原装现货假一赔十
询价
NXP Semiconductors
20+
QFN-68
29860
RF片上系统SOC-可开原型号增税票
询价
Marvell
23+
BGA
30000
代理原装现货,价格优势
询价
MARVELL/Marvell Technology Gro
21+
BGA
94
优势代理渠道,原装正品,可全系列订货开增值税票
询价
MARVELL
22+
QFN
25000
原装现货,价格优惠,假一罚十
询价
Marvell
22+
BGA
32350
原装正品 假一罚十 公司现货
询价
NXP Semiconductors
23+/22+
2000
原装进口订货7-10个工作日
询价
Marvell
21+
BGA
50000
全新原装正品现货,支持订货
询价
NXP
23+
HVQFN68
15462
原包装原标现货,假一罚十,
询价