Slim-Grid Board-to-Board Connectors

Description: Slim-Grid Header, 24 Circuits, Surface Mount, Vertical, Unshrouded, 0.05μm Overall Gold (Au) Plated, with Pick-and-Place Cap, Tube, Lead-Free Application Board-to-Board, Signal

文件：71.31 Kbytes 页数：2 Pages

MOLEX

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Slim-Grid Board-to-Board Connectors

Description: Slim-Grid Header, 24 Circuits, Surface Mount, Vertical, Unshrouded, 0.05μm Overall Gold (Au) Plated, with Pick-and-Place Cap, Tube, Lead-Free Application Board-to-Board, Signal

文件：71.31 Kbytes 页数：2 Pages

MOLEX

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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap

文件：355.81 Kbytes 页数：7 Pages

MOLEX

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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap

文件：355.81 Kbytes 页数：7 Pages

MOLEX

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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap

文件：355.82 Kbytes 页数：7 Pages

MOLEX

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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76關m (30關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap

文件：355.63 Kbytes 页数：7 Pages

MOLEX

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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap

文件：355.81 Kbytes 页数：7 Pages

MOLEX

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1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120)

文件：174.97 Kbytes 页数：4 Pages

MOLEX

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预售连接器

Molex

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包装：散装 类别：工具 压接器，压接机，压力机 - 配件 描述：AMBOSS

TE Application Tooling