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87761

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP

文件:158.98 Kbytes 页数:2 Pages

BELDEN

百通

87761.0021000

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP

文件:158.98 Kbytes 页数:2 Pages

BELDEN

百通

87761.002500

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP

文件:158.98 Kbytes 页数:2 Pages

BELDEN

百通

87761.0025000

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP

文件:158.98 Kbytes 页数:2 Pages

BELDEN

百通

87761-2001

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating

文件:308.98 Kbytes 页数:5 Pages

MOLEX

莫仕

87761-2400

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關m (30關) Gold (Au) Selective Plating

文件:308.99 Kbytes 页数:5 Pages

MOLEX

莫仕

87761-4408

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking

文件:106.44 Kbytes 页数:3 Pages

MOLEX

莫仕

87761-5001

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height

文件:308.98 Kbytes 页数:5 Pages

MOLEX

莫仕

87761-5021

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height

文件:309.25 Kbytes 页数:5 Pages

MOLEX

莫仕

87761-5022

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height

文件:237.45 Kbytes 页数:4 Pages

MOLEX

莫仕

详细参数

  • 型号:

    87761

  • 制造商:

    MOLEX

  • 制造商全称:

    Molex Electronics Ltd.

  • 功能描述:

    2.00mm(.079) Pitch Milli-Grid? Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm(30μ) Gold(Au) Selective Plating

供应商型号品牌批号封装库存备注价格
Belden
22+
NA
80
加我QQ或微信咨询更多详细信息,
询价
MOLEX
24+
con
35960
查现货到京北通宇商城
询价
MOLEX/莫仕
2508+
/
226570
一级代理,原装现货
询价
Molex
25+
18519
原厂现货渠道
询价
更多87761供应商 更新时间2026-1-29 10:09:00