| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
87761 | Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP 文件:158.98 Kbytes 页数:2 Pages | BELDEN 百通 | BELDEN | |
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP 文件:158.98 Kbytes 页数:2 Pages | BELDEN 百通 | BELDEN | ||
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP 文件:158.98 Kbytes 页数:2 Pages | BELDEN 百通 | BELDEN | ||
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP 文件:158.98 Kbytes 页数:2 Pages | BELDEN 百通 | BELDEN | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating 文件:308.98 Kbytes 页数:5 Pages | MOLEX 莫仕 | MOLEX | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關m (30關) Gold (Au) Selective Plating 文件:308.99 Kbytes 页数:5 Pages | MOLEX 莫仕 | MOLEX | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking 文件:106.44 Kbytes 页数:3 Pages | MOLEX 莫仕 | MOLEX | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height 文件:308.98 Kbytes 页数:5 Pages | MOLEX 莫仕 | MOLEX | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height 文件:309.25 Kbytes 页数:5 Pages | MOLEX 莫仕 | MOLEX | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height 文件:237.45 Kbytes 页数:4 Pages | MOLEX 莫仕 | MOLEX |
详细参数
- 型号:
87761
- 制造商:
MOLEX
- 制造商全称:
Molex Electronics Ltd.
- 功能描述:
2.00mm(.079) Pitch Milli-Grid? Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm(30μ) Gold(Au) Selective Plating
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Belden |
22+ |
NA |
80 |
加我QQ或微信咨询更多详细信息, |
询价 | ||
MOLEX |
24+ |
con |
35960 |
查现货到京北通宇商城 |
询价 | ||
MOLEX/莫仕 |
2508+ |
/ |
226570 |
一级代理,原装现货 |
询价 | ||
Molex |
25+ |
18519 |
原厂现货渠道 |
询价 |
相关规格书
更多- 87761-BULK
- 8777
- 87770601000
- 8777060500
- 87772-2
- 87779-1001
- 8777SB0101000
- 8778060500
- 87782-3003
- 87783-0301
- 87797-0400
- 87800-111
- 87803-0012
- 878081-000
- 87809-1(CUTSTRIP)
- 87809-6
- 878122-000
- 87814-615
- 87820091000
- 87831-0421
- 87831-0441
- 87831-0620
- 87831-0643
- 878310820
- 87831-0821
- 87831-1010
- 87831-1021
- 87831-1220
- 87831-1241
- 878311420
- 87831-1421
- 878311620
- 87831-1621
- 87831-1820
- 87831-2020
- 87831-2420
- 87831-2429
- 87831-3020
- 87831-3620
- 87831-4020
- 87831-4420
- 878315541
- 87832-0420
- 87832-0610
- 87832-0620
相关库存
更多- 87762-0006
- 8777060100
- 8777060250
- 8777060U500
- 877791001
- 8777NH0601000
- 8778
- 87782-2001
- 87783-0001
- 8778-CHR-250
- 878
- 87803-0002
- 87803-0112
- 87809-1
- 87809-2
- 878110-GR
- 878126-000
- 878182-000
- 87831-0420
- 878310441
- 878310620
- 87831-0642
- 87831-0819
- 87831-0820
- 87831-0841
- 87831-1020
- 87831-1041
- 87831-1221
- 87831-1419
- 87831-1420
- 87831-1619
- 87831-1620
- 87831-1635
- 87831-2010
- 87831-2021
- 87831-2421
- 87831-2820
- 87831-3220
- 87831-4010
- 87831-4028
- 87831-510-508PPLX-9VB-2AAGRW/BKSIDES
- 87832-0406
- 87832-0606
- 87832-0614
- 87832-0806

