丝印：8401；Package：MICROFOOT；P-Channel 20-V (D-S) MOSFET

文件：83.72 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

丝印：8401001LA；Package：CDIP；DUAL 4-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOPS

• 3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • Choice of True or Inverting Logic − SN54ALS874B, SN74ALS874B, SN74AS874 Have True Outputs − SN74ALS876A, SN74AS876 Have Inverting Outputs • Asynchronous Clear • Package Options Include Plastic Small-Outline

文件：336.6 Kbytes 页数：16 Pages

TI

德州仪器

丝印：84012012A；Package：LCCC；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • True Logic Outputs • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description Thes

文件：1.45425 Mbytes 页数：24 Pages

TI

德州仪器

丝印：8401201RA；Package：CDIP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • True Logic Outputs • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description Thes

文件：1.45425 Mbytes 页数：24 Pages

TI

德州仪器

丝印：8401201SA；Package：CFP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • True Logic Outputs • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description Thes

文件：1.45425 Mbytes 页数：24 Pages

TI

德州仪器

丝印：84012022A；Package：LCCC；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly Bus-Structured Pinout Inverting-Logic Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description These

文件：858.42 Kbytes 页数：14 Pages

TI

德州仪器

丝印：8401202RA；Package：CDIP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly Bus-Structured Pinout Inverting-Logic Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description These

文件：858.42 Kbytes 页数：14 Pages

TI

德州仪器

丝印：8401202SA；Package：CFP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly Bus-Structured Pinout Inverting-Logic Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description These

文件：858.42 Kbytes 页数：14 Pages

TI

德州仪器

丝印：84013022A；Package：LCCC；QUADRUPLE BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Two-Way Asynchronous Communication Between Data Buses pnp Inputs Reduce dc Loading Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These quadruple bus transceivers are designed for

文件：662.04 Kbytes 页数：9 Pages

TI

德州仪器

丝印：84013022A；Package：LCCC；QUADRUPLE BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Two-Way Asynchronous Communication Between Data Buses pnp Inputs Reduce dc Loading Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These quadruple bus transceivers are designed for

文件：662.04 Kbytes 页数：9 Pages

TI

德州仪器