丝印：840；Package：TO-220；8A 500V N-channel Enhancement Mode Power MOSFET

文件：1.63311 Mbytes 页数：12 Pages

WXDH

东海半导体

丝印：840B；Package：SMA；1.5W SURFACE MOUNT ZENER DIODE

Glass Passivated Die Construction 1.5W Power Dissipation 3.3V – 200V Nominal Zener Voltage 5 Standard Vz Tolerance Low Inductance For Use in Voltage Regulator or Reference Plastic Case Material has UL Flammability Classification Rating 94V-0

文件：105.77 Kbytes 页数：5 Pages

WTE

Won-Top Electronics

丝印：840B；Package：SMA；1.5 Watt Plastic Surface Mount Zener Voltage Regulators

Features • Standard Zener Breakdown Voltage Range − 3.3 V to 68 V • ESD Rating of Class 3 (> 16 kV) per Human Body Model • Flat Handling Surface for Accurate Placement • Package Design for Top Slide or Bottom Circuit Board Mounting • Low Profile Package • Ideal Replacement for MELF Packages

文件：225.09 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

丝印：8401001LA；Package：CDIP；DUAL 4-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOPS

• 3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • Choice of True or Inverting Logic − SN54ALS874B, SN74ALS874B, SN74AS874 Have True Outputs − SN74ALS876A, SN74AS876 Have Inverting Outputs • Asynchronous Clear • Package Options Include Plastic Small-Outline

文件：336.6 Kbytes 页数：16 Pages

TI

德州仪器

丝印：84012012A；Package：LCCC；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • True Logic Outputs • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description Thes

文件：1.45425 Mbytes 页数：24 Pages

TI

德州仪器

丝印：8401201RA；Package：CDIP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • True Logic Outputs • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description Thes

文件：1.45425 Mbytes 页数：24 Pages

TI

德州仪器

丝印：8401201SA；Package：CFP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly • Bus-Structured Pinout • True Logic Outputs • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description Thes

文件：1.45425 Mbytes 页数：24 Pages

TI

德州仪器

丝印：84012022A；Package：LCCC；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly Bus-Structured Pinout Inverting-Logic Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description These

文件：858.42 Kbytes 页数：14 Pages

TI

德州仪器

丝印：8401202RA；Package：CDIP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly Bus-Structured Pinout Inverting-Logic Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description These

文件：858.42 Kbytes 页数：14 Pages

TI

德州仪器

丝印：8401202SA；Package：CFP；OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS

3-State Buffer-Type Outputs Drive Bus Lines Directly Bus-Structured Pinout Inverting-Logic Outputs Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), Standard Plastic (N) and Ceramic (J) 300-mil DIPs, and Ceramic Flat (W) Packages description These

文件：858.42 Kbytes 页数：14 Pages

TI

德州仪器