丝印：8103607SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

STANDARD HIGH-SPEED PAL CIRCUITS

文件：357.21 Kbytes 页数：18 Pages

TI

德州仪器

丝印：8103607SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

丝印：8103607SA；Package：CFP；STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

文件：833.12 Kbytes 页数：22 Pages

TI

德州仪器

可编程逻辑器件(CPLD/FPGA)

AMD

超威半导体