74AC16244DLR集成电路（IC）的缓冲器驱动器接收器收发器规格书PDF中文资料

74AC16244DLR属于集成电路（IC）的缓冲器驱动器接收器收发器。由美国德州仪器公司制造生产的74AC16244DLR缓冲器，驱动器，接收器，收发器逻辑缓冲器、驱动器、接收器和收发器允许隔离对某个电路的逻辑信号的访问，以用于另一电路。缓冲器将其输入信号（不变或反相）传递到其输出，并可能用于清除弱信号或驱动负载。在布尔逻辑仿真器中，缓冲器主要用于增加传播延迟。逻辑接收器和收发器允许在数据总线之间进行隔离通信。

Members of the Texas Instruments

Widebus Family

3-State Outputs Drive Bus Lines or Buffer

Memory Address Registers

Flow-Through Architecture Optimizes PCB

Layout

Distributed VCC and GND Configuration

Minimizes High-Speed Switching Noise

EPIC  (Enhanced-Performance Implanted

CMOS) 1-
m Process

500-mA Typical Latch-Up Immunity at

125°C

Package Options Include Plastic 300-mil

Shrink Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages Using 25-mil

Center-to-Center Pin Spacings, and 380-mil

Fine-Pitch Ceramic Flat (WD) Packages

Using 25-mil Center-to-Center Pin Spacings

description

The ’AC16244 are 16-bit buffers/line drivers

designed specifically to improve both the

performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented

receivers and transmitters. They can be used as

four 4-bit buffers, two 8-bit buffers, or one 16-bit

buffer. These devices provide true outputs and

symmetrical active-low output-enable (OE)

inputs. When OE is low, the device passes

noninverted data from the A inputs to the Y

outputs. When OE is high, the outputs are in the

high-impedance state.

The 74AC16244 is packaged in the TI’s shrink small-outline package, which provides twice the I/O pin count

and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of –55°C to 125°C. The

74AC16244 is characterized for operation from –40°C to 85°C.