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72T18115数据手册集成电路(IC)的FIFO存储器规格书PDF

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厂商型号

72T18115

参数属性

72T18115 封装/外壳为240-BGA;包装为托盘;类别为集成电路(IC)的FIFO存储器;产品描述:IC FIFO 262KX18 2.5V 4NS 240BGA

功能描述

256K x 18 / 512K x 9 TeraSync FIFO, 2.5V

封装外壳

240-BGA

制造商

Renesas Renesas Technology Corp

中文名称

瑞萨 瑞萨科技有限公司

数据手册

下载地址下载地址二

更新时间

2025-8-7 23:00:00

人工找货

72T18115价格和库存,欢迎联系客服免费人工找货

72T18115规格书详情

描述 Description

The 72T18115 is a 256K x 18 / 512K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.

特性 Features

User selectable HSTL/LVTTL Input and/or Output
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Program programmable flags by either serial or parallel means
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 240-pin PBGA package
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing simultaneously)
Industrial temperature range (–40C to +85C) is available

技术参数

  • 产品编号:

    72T18115L4-4BB

  • 制造商:

    Renesas Electronics America Inc

  • 类别:

    集成电路(IC) > FIFO 存储器

  • 系列:

    72T

  • 包装:

    托盘

  • 存储容量:

    4.5M(256K x 18)(512K x 9)

  • 功能:

    异步,同步

  • 数据速率:

    100MHz,225MHz

  • 访问时间:

    8ns,3.4ns

  • 电流 - 供电(最大值):

    70mA

  • 总线方向:

    单向

  • 扩充类型:

    深度,宽度

  • 可编程标志支持:

  • 中继能力:

  • FWFT 支持:

  • 工作温度:

    0°C ~ 70°C

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    240-BGA

  • 供应商器件封装:

    240-PBGA(19x19)

  • 描述:

    IC FIFO 262KX18 2.5V 4NS 240BGA

供应商 型号 品牌 批号 封装 库存 备注 价格
RENESAS(瑞萨)/IDT
24+
PBGA240(19x19)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
RENESAS(瑞萨电子)
22+
NA
500000
万三科技,秉承原装,购芯无忧
询价
Renesas
25+
电联咨询
7800
公司现货,提供拆样技术支持
询价
IDT, Integrated Device Technol
24+
240-PBGA(19x19)
53200
一级代理/放心采购
询价
RENESAS(瑞萨)/IDT
2447
PBGA-240(19x19)
315000
1个/托盘一级代理专营品牌!原装正品,优势现货,长期
询价
RENESAS(瑞萨)/IDT
2022+原装正品
PBGA-240(19x19)
18000
支持工厂BOM表配单 公司只做原装正品货
询价
RENESAS(瑞萨)/IDT
2021+
PBGA-240(19x19)
499
询价
24+
N/A
52000
一级代理-主营优势-实惠价格-不悔选择
询价
IDT
1931+
N/A
1186
加我qq或微信,了解更多详细信息,体验一站式购物
询价
IDT
22+
NA
1186
加我QQ或微信咨询更多详细信息,
询价