71V67903S75BG8集成电路（IC）的存储器规格书PDF中文资料

特性 Features

◆ 256K x 36, 512K x 18 memory configurations

◆ Supports fast access times:

– 7.5ns up to 117MHz clock frequency

– 8.0ns up to 100MHz clock frequency

– 8.5ns up to 87MHz clock frequency

◆ LBO input selects interleaved or linear burst mode

◆ Self-timed write cycle with global write control (GW), byte write

enable (BWE), and byte writes (BWx)

◆ 3.3V core power supply

◆ Power down controlled by ZZ input

◆ 3.3V I/O supply (VDDQ)

◆ Packaged in a JEDEC Standard 100-pin thin plastic quad

flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball

grid array (fBGA)

◆ Industrial temperature range (–40°C to +85°C) is available

for selected speeds

◆ Green parts available, see ordering information