71V65703S75BGG集成电路（IC）的存储器规格书PDF中文资料

特性 Features

◆ 256K x 36, 512K x 18 memory configurations

◆ Supports high performance system speed - 100 MHz

(7.5 ns Clock-to-Data Access)

◆ ZBTTM Feature - No dead cycles between write and read

cycles

◆ Internally synchronized output buffer enable eliminates the

need to control OE

◆ Single R/W (READ/WRITE) control pin

◆ 4-word burst capability (Interleaved or linear)

◆ Individual byte write (BW1 - BW4) control (May tie active)

◆ Three chip enables for simple depth expansion

◆ 3.3V power supply (±5)

◆ 3.3V (±5) I/O Supply (VDDQ)

◆ Power down controlled by ZZ input

◆ Packaged in a JEDEC standard 100-pin plastic thin quad

flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch

ball grid array (fBGA)

◆ Industrial temperature range (–40°C to +85°C) is available

for selected speeds

◆ Green parts available, see ordering information