2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 72 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

文件：1.48638 Mbytes 页数：8 Pages

MOLEX

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2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 72 Circuits, 0.76關m Gold (Au) Selective Plating, with 3.30mm PCB Locator Pegs

文件：35.2 Kbytes 页数：2 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 80 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

文件：1.48637 Mbytes 页数：8 Pages

MOLEX

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2.54mm Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 80 Circuits, 0.76關m Gold (Au) Selective Plating, with 3.30mm PCB Locator Pegs

文件：35.11 Kbytes 页数：2 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

文件：1.48631 Mbytes 页数：8 Pages

MOLEX

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2.00mm (.079) Pitch HDM짰 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits

文件：1.48631 Mbytes 页数：5 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum

文件：1.48631 Mbytes 页数：8 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

文件：1.48631 Mbytes 页数：8 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

文件：1.48631 Mbytes 页数：8 Pages

MOLEX

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2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

文件：1.48631 Mbytes 页数：8 Pages

MOLEX

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