丝印：7120；Package：SIP-4L；Single Phase Hall Effect Smart Fan Driver

GENERAL DESCRIPTION The MA7120 is an integrated Hall sensor with H-Bridged output driver designed for brushless DC motor applications. The device includes an on-chip Hall sensor for magnetic sensing, an amplifier that amplifies the Hall voltage, a comparator to provide switching hysteresis for

文件：120.84 Kbytes 页数：2 Pages

MPOWERMajor-Power Technology Co., LTD.

久昌科技久昌科技股份有限公司

丝印：7120-2A；Package：PG-TSDSO-14；PROFET??2 12V 2x 120 m廓 Smart High-Side Power Switch

文件：1.85777 Mbytes 页数：61 Pages

Infineon

英飞凌

Common Mode EMI Inductors

[J.W.Miller] Special Features •Reduce conductive EMI emission •High current capacity •High impedance at low frequency •Dielectric strength 3750VRMS •Coil wound on VW-1 rated plastic cased ferrite core •Operating temperature -55 to +105°C

文件：36.35 Kbytes 页数：1 Pages

ETC1List of Unclassifed Manufacturers

etc未分类制造商未分类制造商

PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY FLAMMAHILITY CLASSIFICATION 94V-0

FEATURES • PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY FLAMMAHILITY CLASSIFICATION 94V-0 • LOW ZENER IMPEDANCE • EXCELLENT CLAMPINGCAPABILITY

文件：94.34 Kbytes 页数：1 Pages

NJSEMINew Jersey Semi-Conductor Products, Inc.

新泽西半导体新泽西半导体公司

COM Express Type 10 Mini Module with Intel Atom® x6000E/RE Series or Intel® Celeron® N/J Series

Features ● Intel Atom® x6000E/RE series or Intel® Celeron® N/J processor (Elkhart Lake) ● 8GB/16GB LPDDR4 onboard memory, up to 3200MT/s ● Up to 4 lanes of PCI Express Gen3 ● 2 SATA 3.0 ● 2 USB 3.2 Gen2 and 8 USB 2.0 ● eMMC 5.1 and TPM 2.0 onboard

文件：342.8 Kbytes 页数：3 Pages

AXIOMTEK

艾讯科技

COM Express Type 10 Mini Module with Intel Atom® x6000E/RE Series or Intel® Celeron® N/J Series

Features ● Intel Atom® x6000E/RE series or Intel® Celeron® N/J processor (Elkhart Lake) ● 8GB/16GB LPDDR4 onboard memory, up to 3200MT/s ● Up to 4 lanes of PCI Express Gen3 ● 2 SATA 3.0 ● 2 USB 3.2 Gen2 and 8 USB 2.0 ● eMMC 5.1 and TPM 2.0 onboard

文件：342.8 Kbytes 页数：3 Pages

AXIOMTEK

艾讯科技

COM Express Type 6 Compact Module with 13th/12th Gen Intel® Core™ or Celeron® Processor

Features ● 13th/12th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Raptor Lake U/Alder Lake U) ● Dual channel DDR4-3200 SO-DIMM for up to 64GB memory ● Up to 12 lanes of PCI Express ● 2 SATA Gen3 ● 4 USB 3.2 and 8 USB 2.0 ● Supports NVMe for up to 512GB ● Supports TPM 2.0

文件：460.65 Kbytes 页数：3 Pages

AXIOMTEK

艾讯科技

Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers

Introduction Most package vendors have very little microwave design and characterization capability. Their lim ited characterization efforts typically involve the use of poor fixturing, which obscures the true frequency response of the package. Companies specializing in fixturing, while investi

文件：136.47 Kbytes 页数：4 Pages

MA-COM

WA-HST Polyolefine Heat Shrink Tube

General Information: Operating Temperature -55 up to +135 °C Storage Conditions (in original packaging)

文件：276.36 Kbytes 页数：4 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

Common Mode EMI Chokes

Special Features • Reduce conductive EMI emission • High current capacity • High impedance at low frequency • Dielectric strength 3750 Vrms • Coil wound on UL 94V-0 rated plastic cased ferrite core • Operating temperature -55 to +105 °C

文件：75.72 Kbytes 页数：1 Pages

Bourns

伯恩斯