Common Mode EMI Chokes

Special Features • Dual winding • Low radiation • High current capacity • High inductance • Dielectric strength 1000Vrms • Mounted on VW-1 rated header • Fixed pins for easy PCB insertion • Operating temperature -55 to +105°C

文件：55.4 Kbytes 页数：1 Pages

BOURNS

伯恩斯

This series of detectors can detect fixed voltages from 2.2V to 7V.

Low power consumption, typical value: 2.0uA Wide operating voltage range: 1.5V～12V Low temperature drift detection voltage: typical value ±50pp m/℃ Built-in hysteresis feature High-precision voltage value detection: ±3 Small package: SOT89-3, TO92, SOT23-3

文件：3.70158 Mbytes 页数：8 Pages

UMW

友台半导体

4K x 16 Dual-Port RAM

The 7024 is a high-speed 4Kx 16 Dual-Port Static RAM designed to be used as a stand-alone 64K-bit Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit or more word systems. An automatic power down feature controlled by Chip Enable (CE) permits the on-chip circuitry of each port to True Dual-Ported memory cells which allow simultaneous reads of the same memory location\nSeparate upper-byte and lower-byte control for multiplexed bus compatibility\n7024 easily expands data bus width to 32 bits or more\nInterrupt Flag and On-chip port arbitration logic\nFull on-chip hardware supp;

Renesas

瑞萨

丝印：7024；Package：SIP-3L；Single Output Hall Effect Latch

GENERAL DESCRIPTION MA7024 is an integrated Hall-Effect latch sensor with pull-up resistor designed for electronic commutation of brush-less DC motor applications. The device is using HV BCD process includes an on-chip Hall voltage generator for magnetic sensing, a comparator that amplifies th

文件：123.79 Kbytes 页数：2 Pages

MPOWERMajor-Power Technology Co., LTD.

久昌科技久昌科技股份有限公司

包装：散装 类别：连接器，互连器件 接线柱 描述：CONN BIND POST HEX YELLOW

Keystone Electronics

Package：径向；包装：托盘 类别：电感器，线圈，扼流圈 阵列，信号转换器 描述：INDUCT ARRAY 2 COIL 525UH T/H

Bourns Inc.

C-Grid Connector Products

Description: 2.54mm Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Application Signal, Wire-to-Board

文件：31.25 Kbytes 页数：2 Pages

MOLEX

莫仕

C-Grid Connector Products

Description: 2.54mm Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Application Signal, Wire-to-Board

文件：31.25 Kbytes 页数：2 Pages

MOLEX

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C-Grid® Products

Description: 2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：29.36 Kbytes 页数：2 Pages

MOLEX

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C-Grid® Products

Description: 2.54mm Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded, 20 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

文件：29.36 Kbytes 页数：2 Pages

MOLEX

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