丝印：2Y1；Package：SOT-23；Plastic-Encapsulated Diode

FEATURES  Planar die construction  300mW Power dissipation  Zener voltages from 2.4V - 39V  Ultra-small surface mount package Power dissipation  AEC-Q101 qualified

文件：1.21605 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：2Y1；Package：SOD-523；SOD-523 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 150mW Power Dissipation Zener Voltages from 2.4 to 20V

文件：2.90385 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：2Y1；Package：SOD-523；ZENER DIODE

Features Constant Voltage Control Wide Voltage Range Selection 2.4V To 75V

文件：260.23 Kbytes 页数：3 Pages

DAESAN

丝印：2Y1；Package：SOT-23；SOT-23 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 300mW Power Dissipation Zener Voltages from 2.4V to 39V Ultra-Small Surface Mount Package Power Dissipation

文件：2.75932 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：2Y1；Surface Mount Zener Voltage Regulator Diodes

FEATURES • Planar Die Construction • 300 mW Power Dissipation on FR-5 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Process • Zener Voltages from 2.4V – 39V • Ultra-Small Surface Mount Package Power Dissipation

文件：77 Kbytes 页数：2 Pages

SECELECTRONICS

上优电子

丝印：2Y10；Package：SOT-23；Plastic-Encapsulated Diode

FEATURES  Planar die construction  300mW Power dissipation  Zener voltages from 2.4V - 39V  Ultra-small surface mount package Power dissipation  AEC-Q101 qualified

文件：1.21605 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：2Y11；Package：SOT-23；Plastic-Encapsulated Diode

FEATURES  Planar die construction  300mW Power dissipation  Zener voltages from 2.4V - 39V  Ultra-small surface mount package Power dissipation  AEC-Q101 qualified

文件：1.21605 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：2Y12；Package：SOT-23；Plastic-Encapsulated Diode

FEATURES  Planar die construction  300mW Power dissipation  Zener voltages from 2.4V - 39V  Ultra-small surface mount package Power dissipation  AEC-Q101 qualified

文件：1.21605 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：2Y13；Package：SOT-23；Plastic-Encapsulated Diode

FEATURES  Planar die construction  300mW Power dissipation  Zener voltages from 2.4V - 39V  Ultra-small surface mount package Power dissipation  AEC-Q101 qualified

文件：1.21605 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：2Y14；Package：SOT-23；Plastic-Encapsulated Diode

FEATURES  Planar die construction  300mW Power dissipation  Zener voltages from 2.4V - 39V  Ultra-small surface mount package Power dissipation  AEC-Q101 qualified

文件：1.21605 Mbytes 页数：6 Pages

SY

顺烨电子