首页 >2PC4617R/ZR>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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NPNgeneralpurposetransistors FEATURES •Leadlessultrasmallplasticpackage(1mm×0.6mm×0.5mm) •Boardspace1.3×0.9mm •PowerdissipationcomparabletoSOT23. | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
NPNgeneralpurposetransistors FEATURES •Leadlessultrasmallplasticpackage(1mm×0.6mm×0.5mm) •Boardspace1.3×0.9mm •PowerdissipationcomparabletoSOT23. APPLICATIONS •GeneralpurposesmallsignalDCapplications •LowandmediumfrequencyACapplications •Mobilecommunications,digital(still)cameras,PDA | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
50V,100mANPNgeneral-purposetransistors Featuresandbenefits *LeadlessultrasmallSMDplastic package *PowerdissipationcomparabletoSOT23 *Lowpackageheightof0.37mm *AEC-Q101qualified | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
40V,100mAPNPgeneral-purposetransistors Featuresandbenefits *LeadlessultrasmallSMDplastic package *PowerdissipationcomparabletoSOT23 *Lowpackageheightof0.37mm *AEC-Q101qualified | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
50V,100mANPNgeneral-purposetransistors Generaldescription NPNgeneral-purposetransistorsinaleadlessultrasmallDFN1006B-3(SOT883B)Surface-MountedDevice(SMD)plasticpackage. Featuresandbenefits ■LeadlessultrasmallSMDplastic package ■PowerdissipationcomparabletoSOT23 ■Lowpackageheightof0.37mm ■AEC | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
NPNgeneralpurposetransistor DESCRIPTION NPNtransistorinanSC-75plasticpackage. PNPcomplement:2PA1774. FEATURES •Lowcurrent(max.100mA) •Lowvoltage(max.50V). APPLICATIONS •Generalpurposeswitchingandamplificationincommunication,electronicdataprocessing(EDP)andconsumerapplications. | PhilipsPhilips Semiconductors 飞利浦荷兰皇家飞利浦 | Philips | ||
NPNgeneral-purposetransistor Features *Lowcurrent(max.150mA) *Lowvoltage(max.50V) | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
NPNgeneralpurposetransistors FEATURES •Leadlessultrasmallplasticpackage(1mm×0.6mm×0.5mm) •Boardspace1.3×0.9mm •PowerdissipationcomparabletoSOT23. APPLICATIONS •GeneralpurposesmallsignalDCapplications •LowandmediumfrequencyACapplications •Mobilecommunications,digital(still)cameras,PDA | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
NPNgeneralpurposetransistors FEATURES •Leadlessultrasmallplasticpackage(1mm×0.6mm×0.5mm) •Boardspace1.3×0.9mm •PowerdissipationcomparabletoSOT23. | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA | ||
50V,100mANPNgeneral-purposetransistors Generaldescription NPNgeneral-purposetransistorsinaleadlessultrasmallDFN1006B-3(SOT883B)Surface-MountedDevice(SMD)plasticpackage. Featuresandbenefits ■LeadlessultrasmallSMDplastic package ■PowerdissipationcomparabletoSOT23 ■Lowpackageheightof0.37mm ■AEC | NEXPERIANexperia B.V. All rights reserved 安世安世半导体(中国)有限公司 | NEXPERIA |
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