丝印：280；Package：M1；AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler

Features ■ Compact 4-pin package (2.4mm maximum standoff height) ■ Half pitch leads for optimum board space savings ■ Current Transfer Ratio: 50–600% ■ Available in tape and reel quantities of 2500 ■ CSA (File #1201524), UL (File #E90700) and VDE (File #136480) certified Applications

文件：699.2 Kbytes 页数：11 Pages

ONSEMI

安森美半导体

丝印：280；Package：M1；AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler

Features ■ Compact 4-pin package (2.4mm maximum standoff height) ■ Half pitch leads for optimum board space savings ■ Current Transfer Ratio: 50–600% ■ Available in tape and reel quantities of 2500 ■ CSA (File #1201524), UL (File #E90700) and VDE (File #136480) certified Applications

文件：699.2 Kbytes 页数：11 Pages

ONSEMI

安森美半导体

丝印：280；Package：M1；AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler

Features ■ Compact 4-pin package (2.4mm maximum standoff height) ■ Half pitch leads for optimum board space savings ■ Current Transfer Ratio: 50–600% ■ Available in tape and reel quantities of 2500 ■ CSA (File #1201524), UL (File #E90700) and VDE (File #136480) certified Applications

文件：699.2 Kbytes 页数：11 Pages

ONSEMI

安森美半导体

丝印：280；Package：M1；AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler

Features ■ Compact 4-pin package (2.4mm maximum standoff height) ■ Half pitch leads for optimum board space savings ■ Current Transfer Ratio: 50–600% ■ Available in tape and reel quantities of 2500 ■ CSA (File #1201524), UL (File #E90700) and VDE (File #136480) certified Applications

文件：699.2 Kbytes 页数：11 Pages

ONSEMI

安森美半导体

丝印：280；Package：TO-94；Smart Two-Phase DC Fan

文件：295.33 Kbytes 页数：9 Pages

SDC

光大芯业

丝印：2800EP；Package：SOIC；LOW-POWER BICMOS CURRENT-MODE PWM

Controlled Baseline − One Assembly − One Test Site − One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† ESD Protection Exceeds 200 V Using Machine M

文件：533.97 Kbytes 页数：19 Pages

TI

德州仪器

丝印：2800EP；Package：SOIC；LOW-POWER BICMOS CURRENT-MODE PWM

Controlled Baseline − One Assembly − One Test Site − One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† ESD Protection Exceeds 200 V Using Machine M

文件：533.97 Kbytes 页数：19 Pages

TI

德州仪器

丝印：2801EP；Package：SOIC；LOW-POWER BICMOS CURRENT-MODE PWM

Controlled Baseline − One Assembly − One Test Site − One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† ESD Protection Exceeds 200 V Using Machine M

文件：533.97 Kbytes 页数：19 Pages

TI

德州仪器

丝印：2801EP；Package：SOIC；LOW-POWER BICMOS CURRENT-MODE PWM

Controlled Baseline − One Assembly − One Test Site − One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† ESD Protection Exceeds 200 V Using Machine M

文件：533.97 Kbytes 页数：19 Pages

TI

德州仪器

丝印：2801EP；Package：SOIC；LOW-POWER BICMOS CURRENT-MODE PWM

Controlled Baseline − One Assembly − One Test Site − One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† ESD Protection Exceeds 200 V Using Machine M

文件：533.97 Kbytes 页数：19 Pages

TI

德州仪器