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230-75AB

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

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230-75ABE-01

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

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230-75ABE-05

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

ETCList of Unclassifed Manufacturers

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230-75ABE-10

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件:8.04467 Mbytes 页数:21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

230-75AB-01

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

230-75AB-05

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

230-75AB-10

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

230-75ABG

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes 页数:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

230-75AB

包装:散装 类别:风扇,热管理 热敏 - 散热器 描述:HEATSINK TO-220 VERT/HORZ BLK

Wakefield-Vette

Wakefield-Vette

产品属性

  • 产品编号:

    230-75AB

  • 制造商:

    Wakefield-Vette

  • 类别:

    风扇,热管理 > 热敏 - 散热器

  • 系列:

    230

  • 包装:

    散装

  • 类型:

    插件板级

  • 冷却的封装:

    TO-220

  • 连接方法:

    把紧螺栓

  • 形状:

    矩形,鳍片

  • 长度:

    0.750"(19.05mm)

  • 宽度:

    0.570"(14.47mm)

  • 鳍片高度:

    0.500"(12.70mm)

  • 不同温升时功率耗散:

    2.0W @ 57°C

  • 不同强制气流时热阻:

    7.50°C/W @ 400 LFM

  • 自然条件下热阻:

    28.50°C/W

  • 材料:

  • 材料表面处理:

    黑色阳极化处理

  • 描述:

    HEATSINK TO-220 VERT/HORZ BLK

供应商型号品牌批号封装库存备注价格
WAKEFIELDENGINEERING
21+
NA
6000
只做原装,一定有货,不止网上数量,量多可订货!
询价
WAKEFIELD
46
询价
WAKEFIELD
24+
con
46
现货常备产品原装可到京北通宇商城查价格
询价
24+
N/A
56000
一级代理-主营优势-实惠价格-不悔选择
询价
BEL COMPANIES
2450+
SOP
6540
只做原厂原装正品终端客户免费申请样品
询价
PHOENIX
25+
连接器
93
就找我吧!--邀您体验愉快问购元件!
询价
TE/泰科
24+
32812
原厂现货渠道
询价
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
询价
TE/泰科
2508+
/
209858
一级代理,原装现货
询价
TE
21+
标准封装
100
保证原装正品,需要请联系张小姐13544103396
询价
更多230-75AB供应商 更新时间2026-1-17 8:26:00