丝印：2274ME；Package：SOIC；Advanced LinCMOS™ RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Output Swing Includes Both Supply Rails Low Noise .

文件：1.07329 Mbytes 页数：43 Pages

TI

德州仪器

丝印：2274ME；Package：SOIC；Advanced LinCMOS™ RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Output Swing Includes Both Supply Rails Low Noise .

文件：1.07329 Mbytes 页数：43 Pages

TI

德州仪器

丝印：2274ME；Package：SOIC；Advanced LinCMOS™ RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree† Output Swing Includes Both Supply Rails Low Noise .

文件：1.07329 Mbytes 页数：43 Pages

TI

德州仪器