Moiding power lnducto rs

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LEIDITECH

雷卯电子

Molding Power Inductors

文件：371.43 Kbytes 页数：9 Pages

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MINI MOLDED POWER INDUCTOR

Features • Shielded construction for minimized EMI. • Low DCR (as low as 8mΩ) for better efficiency • High current up to 14.5A handling capability. • Compact size that is suitable for high-density designs • Excellent for high frequency switching applications due to SRF up to 264MHz. Applic

文件：1.15388 Mbytes 页数：5 Pages

ABRACON

Multi-Layer Chip Inductors

文件：208.68 Kbytes 页数：2 Pages

Bourns

伯恩斯

Multi-Layer Chip Inductors

文件：751.89 Kbytes 页数：2 Pages

Bourns

伯恩斯