180NQ035R-1中文资料桑德斯微电子数据手册PDF规格书

150℃ TJ operation

Unique high power, Half-Pak module

Replaces three parallel DO-5’S

Easier to mount and lower profile than DO-5’S

High purity, high temperature epoxy encapsulation

for enhanced

mechanical strength and moisture resistance

Low forward voltage drop

High frequency operation

Guard ring for enhanced ruggedness and long term reliability

Base plate: Nickel plated; Terminals: Nickel plated

This is a Pb − Free Device

All SMC parts are traceable to the wafer lot

Additional testing can be offered upon request