丝印：18；Package：DO-214AB；Surface Mount Transient Voltage Suppressor Power 3000Watts

FEATURES For surface mounted applications in order tooptimize board space. Low profile package. Glass passivated junction. Low inductance. 3000W peak pulse power capability at 10x1000us waveform, repetition rate (duty cycles):0.01 Plastic package has Underwriters Laboratory Flammability.

文件：325.35 Kbytes 页数：5 Pages

YFWDIODE

佑风微

丝印：18；Package：fSV；CMOS Digital Integrated Circuits Silicon Monolithic

Functional Description • 2-Input Exclusive-OR Gate with Level Shifting Features (1) Wide operating temperature range: Topr = -40 to 125 (2) Operating supply voltage range: VCC = 2.3 V to 3.6 V (3) The high-level input voltage is up translation to the power supply voltage. (4) The high-level

文件：166.46 Kbytes 页数：9 Pages

TOSHIBA

东芝

丝印：18；Package：USV；CMOS Digital Integrated Circuits Silicon Monolithic

Functional Description • 2-Input Exclusive-OR Gate with Level Shifting Features (1) Wide operating temperature range: Topr = -40 to 125 (2) Operating supply voltage range: VCC = 2.3 V to 3.6 V (3) The high-level input voltage is up translation to the power supply voltage. (4) The high-level

文件：165.64 Kbytes 页数：9 Pages

TOSHIBA

东芝

丝印：18；Package：SOD-323；1-Line Bi-directional TVS Diode

Features  500W peak pulse power (8/20μs)  Protects one data or power line  Ultra low leakage: nA level  Operating voltage: 3.3V，5V, 8V, 12V, 15V, 24V, 36V, 40V  Ultra low clamping voltage  Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV C

文件：2.01557 Mbytes 页数：7 Pages

SY

顺烨电子

丝印：18；Package：178M18CP；Three-Terminal Regulator

STRUTURE : Silicon Monolithic Intergrated Circuit TYPE : Three-Terminal Regulator FEATURES : Output current up to 0.5A

文件：359.61 Kbytes 页数：6 Pages

ROHM

罗姆

丝印：18；Package：3-4E1S；Zener Diode Silicon Epitaxial Planar

Applications • Surge absorber Features (1) Power dissipation : PD = 2W (2) Zener voltage : Vz = 12 to 51V (3) The use of small, thin surface-mount package is optimum way for high-density mounting. Nickname: M-FLATTM

文件：266.72 Kbytes 页数：6 Pages

TOSHIBA

东芝

丝印：18；Package：X1-DFN1006-2；18V UNI-DIRECTIONAL TVS DIODE

Features  Low Profile Package (0.53mm Max) and Ultra-Small PCB Footprint Area (1.08mm * 0.68mm Max) Suitable for Compact Portable Electronics  Provides ESD Protection per IEC 61000-4-2 Standard: Air ±30kV, Contact ±30kV  1 Channel of ESD Protection  Low Channel Input Capacitance  Tota

文件：294.75 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：18；Package：0201/DFN0603；Transient Voltage Suppressors for ESD Protection

Features Protects One Bidirectional I/O Line Low Clamping Voltage Surface mount package. Ultra small SMD package. Stand−off Voltage: 1.8 V Low leakage current 162 Watts Peak Pulse Power per Line (tp=8/20μs) IEC61000-4-5 (LIGHTING) 18A (8/20μs) Provides ESD protection to IEC61000-4-2(ESD):

文件：2.52074 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：18；Package：0201/DFN0603；Transient Voltage Suppressors for ESD Protection

Features Moisture Sensitivity Level (MSL-1) AEC-Q101 qualified Ultra small SMD package Protects One Bidirectional I/O line Low clamping voltage Working voltage:1.8V Low leakage current IEC61000-4-5LIGHTING) 18A(8/20μs) IEC61000-4-2(ESD):±30kV (air discharge) ±30kV (contact discharge);

文件：2.47275 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：18；Package：1206；SURFACE MOUNT ZENER DIODE

FEATURES • For surface mounted application • Silicon epitaxial planar diode • Ultra small surface mount package • Low leakage current • 2 tolerance device of Vz • Lead-Free Finish; RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3)

文件：427.4 Kbytes 页数：5 Pages

DIODES

美台半导体