8 Industrial-Grade Tablet with Qualcomm® Snapdragon™ 660 Processor, Android 12 with Android Enterprise Recommended

Features ƒ Qualcomm® Snapdragon™ 660 with Android 12 and Android Enterprise Recommended ƒ Certified for Google Mobile Services for downloading apps and APIs ƒ 8 LCD with 400-nit brightness, 1920 x 1200 resolution ƒ Corning® Gorilla® Glass 3 touchscreen supports gloved and stylus operation ƒ

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Compact 1U High Performance Server based on Intel® Xeon® Processor Scalable Family

Features ƒ 1U 20 deep rackmount server ƒ Single Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 6x DIMM sockets support up to 384 GB DDR4 2933MHz ECC RDIMM/LRDIMM ƒ Rich Add-In Card Support: Up to two FH/FL PCIe x8 Gen3 slots (optional: one FH/FL PCIe x16 Gen3 slot), one LP PCIe x8

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Compact 2U Carrier Grade, High Performance Server based on AMD EPYC™ 7003/7002 Series Processors

Features ƒ 2U 20.4 deep rackmount server ƒ Single AMD EPYC™ 7003/7002 Series Processors ƒ 16 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 4 x FH/FL PCIe x16 Gen4 + 2 low profile x8 slots, or 2 x FH|FL PCIe 4.0 x16 slots + 2 x FH/FL PCIe 4.0 x8 slots + 2 x FH|HL PCIe 4.0 x8 slots + 2

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Compact 2U High Capacity Storage Server based on Intel® Xeon® Processor Scalable Family

Features ƒƒ 2U 27.5 deep rackmount server ƒƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor (Up to 205W TDP) ƒƒ 16x DIMM sockets support up to 1024GB DDR4 2666 / 2933 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒƒ Rich Add-In Card Support: Up to four FH/FL PCIe x8 Gen3 slots, two FH/HL PCIe x

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Compact 2U Edge Server based on Dual 3rd Gen Intel® Xeon® Scalable Processors

Features ƒ 2U 20.4 deep rackmount server for 5G open RAN and edge computing ƒ Dual 3rd Gen Intel® Xeon® Scalable Processor supporting Platinum, Gold and Silver SKUs ƒ 32 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 4 x FH/FL PCIe x16 Gen4 +2 low profile x8 slots, or 2 x FH|FL PCIe 4

文件：889.4 Kbytes 页数：2 Pages

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Compact 2U Carrier Grade, High Performance Server based on Intel® Xeon® Processor Scalable Family

Features ƒ 2U 20 deep rackmount server ƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor (Up to 165W TDP) ƒ 16x DIMM sockets support up to 1024GB DDR4 2666 / 2933 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ Rich Add-In Card Support: Up to four FH/FL PCIe x8 Gen3 slots, two FH/HL PCIe x8 Gen3

文件：1.11659 Mbytes 页数：2 Pages

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1U High Performance Server based on 4th Gen Intel® Xeon® Processor Scalable Family

Features ƒ 1U 31 deep rackmount server ƒ Dual Intel® Xeon® Scalable Gold6, Gold5, Silver or Bronze processor ƒ 32 x DIMM sockets support up 2048GB DDR5 4800/4400 MT/s ƒ PCIe5.0 add-in cards support up to two full-high 3/4 length (FH | 3/4L) PCIe x16 and one OCP3.0 PCIe x16 ƒ Up to twelve NVM

文件：546.68 Kbytes 页数：2 Pages

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Compact 1U Edge Server based on 3rd Gen Intel Xeon Scalable Processors

Features ƒ 1U 20.4” deep rackmount server for 5G Open RAN and edge computing ƒ Single 3rd Gen Intel® Xeon® Scalable Processor supporting Platinum, Gold and Silver SKUs ƒ 8 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 2 x FH/FL PCIe x16 Gen4 and 2xFH/HL PCIe x16 Gen4 slots ƒ 4 x 2.5

文件：834.27 Kbytes 页数：2 Pages

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Compact 1U High Performance Server based on 2nd Gen Intel® Xeon® Scalable Processor Family

Features ƒ 1U 29.5 deep rackmount server ƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 24 x DIMM sockets support up to 1536 GB DDR4 1600/1866/2133/2400/ 2666 MHz SDRAM (ECC/RDIMM/LRDIMM) ƒ Rich Add-In Card Support: Up to four FH/¾L PCIe x16 Gen3 slots ƒ Up to 4 x 2.5 hot-s

文件：828.9 Kbytes 页数：2 Pages

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Compact 2U Carrier Grade, High Performance Server based on AMD EPYC™ 7003/7002 Series Processors

Features ƒ 2U 20.4 deep rackmount server ƒ Single AMD EPYC™ 7003/7002 Series Processors ƒ 16 x DIMM sockets DDR4 3200 MHz DDR4 (ECC/RDIMM/LRDIMM) ƒ 4 x FH/FL PCIe x16 Gen4 + 2 low profile x8 slots, or 2 x FH|FL PCIe 4.0 x16 slots + 2 x FH/FL PCIe 4.0 x8 slots + 2 x FH|HL PCIe 4.0 x8 slots + 2

文件：996.44 Kbytes 页数：2 Pages

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