159CMQ150中文资料桑德斯微电子数据手册PDF规格书
159CMQ150规格书详情
175 C TJ operation
Isolated heatsink
Multiple leads per terminal for high frequency, high
current PC board mounting
Low profile, high current package
Center tap module
Low forward voltage drop
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
High frequency operation
Guard ring for enhanced ruggedness and long term reliability
Base plate: Nickel plated; Terminals: Nickel plated
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
