15800645中文资料下载库存现货莫仕Molex-114ic电子网

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型号	下载订购	功能描述	制造商上传企业	LOGO
15800645	文件：300 bytes Page：1 Pages	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating	Molex 莫仕	Molex
15800687	文件：300 bytes Page：1 Pages	2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing	Molex 莫仕	Molex
1586017-4	文件：0 bytes Page：0 Pages	Reel	TE 上传：北京京北通宇电子元件有限公司	TE
1587829-2	文件：0 bytes Page：0 Pages	连接器	TE 上传：瀚佳科技(深圳)有限公司	TE
1587829-3	文件：0 bytes Page：0 Pages	连接器	TE 上传：瀚佳科技(深圳)有限公司	TE

更多158006供应商更新时间2026-1-28 16:26:00