1.5SMCBBA中文资料友台半导体数据手册PDF规格书
1.5SMCBBA规格书详情
FEATURES
• Low profile package with built-in strain relief for
surface mounted applications
• Glass passivated junction
• Low incremental surge resistance
• Low inductance
• Excellent clamping capability
• 1500W peak pulse power capability with a 10/1000μs
waveform, repetition rate (duty cycle): 0.01%
• Very fast response time
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
