1.5KE500C中文资料硕凯电子数据手册PDF规格书

Features

♦ Glass passivated chip junction in DO-15 Package

♦ Low leakage

♦ Uni and Bidirectional unit

♦ Excellent clamping capability

♦ 600W Peak power capability at 10 × 1000µs waveform Repetition rate (duty cycle):0.01

♦ Fast response time: typically less than 1.0ps from 0 Volts to VBR min

♦ Typical IR less than 5μA above 12V.

♦ High Temperature soldering: 260°C/40 seconds at terminals

♦ Typical maximum temperature coefficient ΔVBR = 0.1 × VBR@25°C× ΔT

♦ Plastic package has Underwriters Laboratory Flammability 94V-0

♦ Matte tin lead–free Plated

♦ Halogen free and RoHS compliant

♦ Typical failure mode is short from over-specified voltage or current

♦ Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

♦ IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

♦ ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)

♦ EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)