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1-5179031-0连接器互连器件的阵列边缘型夹层式(板对板)规格书PDF中文资料

1-5179031-0
厂商型号

1-5179031-0

参数属性

1-5179031-0 包装为卷带(TR);类别为连接器互连器件的阵列边缘型夹层式(板对板);产品描述:CONN PLUG 200POS SMD GOLD

功能描述

Stacking Height Guide for Parallel Board-to-Board Applications

文件大小

769.13 Kbytes

页面数量

13

生产厂商 Tyco Electronics
企业简称

MACOM

中文名称

玛科姆技术方案控股有限公司官网

原厂标识
MACOM
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-8-4 22:58:00

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1-5179031-0规格书详情

Fine Pitch SMT Stacking Connectors (Parallel Board-to-Board)

Tyco Electronics 0.8mm FH surface-mount connectors are designed for parallel board stacking applications using subminiature connectors to meet today’s electronic industry requirements for high density packaging.

It is possible to save more than 50 of the required board space when compared to conventional 1.27 [.050] centerline connectors.

Product Facts

■ For parallel board stacking applications

■ High density packaging on 0.8 [.031] centerline spacing

■ Available sizes from 40 to 200 positions (in 20 position increments)

■ Board stacking heights available from 5 [.197] to 16 [.630] (in 1 [.039] increments)

■ Bellows type spring contacts are resistant to scooping and stubbing during mating and unmating

■ Positioning bosses for proper on-board orientation

■ Available packaged on“tape-and-reel” for automatic placement per EIA standards

■ Recognized under the Component Program of Underwriter Laboratories Inc., File No. E28476

产品属性

  • 产品编号:

    1-5179031-0

  • 制造商:

    TE Connectivity AMP Connectors

  • 类别:

    连接器,互连器件 > 阵列,边缘型,夹层式(板对板)

  • 系列:

    Free Height (FH)

  • 包装:

    卷带(TR)

  • 连接器类型:

    插头,中央触点带

  • 针位数:

    200

  • 间距:

    0.031"(0.80mm)

  • 安装类型:

    表面贴装型

  • 特性:

    板导轨

  • 触头表面处理:

    镀金

  • 触头表面处理厚度:

    8.00µin(0.203µm)

  • 接合堆叠高度:

    8mm,12mm,16mm,20mm

  • 板上高度:

    0.299"(7.60mm)

  • 描述:

    CONN PLUG 200POS SMD GOLD

供应商 型号 品牌 批号 封装 库存 备注 价格
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2016+
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