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IRF6637PBF中文资料PDF规格书
IRF6637PBF规格书详情
Description
The IRF6637PbF combines the latest HEXFET® power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80.
● RoHS Compliant
● Lead-Free (Qualified up to 260°C Reflow)
● Application Specific MOSFETs
● Ideal for CPU Core DC-DC Converters
● Low Conduction Losses and Switching Losses
● Low Profile (<0.7mm)
● Dual Sided Cooling Compatible
● Compatible with existing Surface Mount Techniques
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
Infineon Technologies |
21+ |
DirectFET? Isometric MP |
13880 |
公司只售原装,支持实单 |
询价 | ||
IR |
0637+ |
QFN |
9563 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
IR |
1725+ |
SMD |
6528 |
只做原装正品现货!或订货假一赔十! |
询价 | ||
IR |
23+ |
SMD |
30000 |
原装现货,假一赔十. |
询价 | ||
IR |
23+ |
QFN |
9896 |
询价 | |||
IOR |
2007 |
DIRECTFET |
91 |
原装现货海量库存欢迎咨询 |
询价 | ||
IR |
23+ |
QFN |
3200 |
全新原装、诚信经营、公司现货销售 |
询价 | ||
IR |
2022 |
SMD |
80000 |
原装现货,OEM渠道,欢迎咨询 |
询价 | ||
IR |
0509+ |
QFN |
15013 |
询价 | |||
IR |
QFN |
6000 |
原装现货,长期供应,终端可账期 |
询价 |