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TB0230A

70 MHz IF SAW Filter (DIP 20.2횞12.6 mm)

TAI-SAW

TAI-SAW TECHNOLOGY CO., LTD.

TB0230A

SAW Filter: 70.0MHz

GOLLEDGEGolledge Electronics Ltd

高利电子高利电子有限公司

ACDBQC0230R-HF

SMDSchottkyBarrierDiode

Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ACDBUC0230-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

AR0230

FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

AR0230CS

1/2.7-Inch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

AR0230CS

1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ASB0230

SMDSchottkyBarrierDiode

Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold

ANACHIP

易亨易亨电子股份有限公司

B0230D

N-ChannelMOSFETusesadvancedtrenchtechnology

DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD.

杜因特深圳市杜因特半导体有限公司

CDBER0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBERT0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230-HF

SMDSchottkyBarrierDiode

Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

详细参数

  • 型号:

    TB0230A

  • 制造商:

    TAI-SAW

  • 制造商全称:

    TAI-SAW

  • 功能描述:

    70 MHz IF SAW Filter(DIP 20.2×12.6 mm)

供应商型号品牌批号封装库存备注价格
L3 NARDA-MITEQ
22+
NA
500000
万三科技,秉承原装,购芯无忧
询价
TST
21+
标准封装
6000
进口原装,订货渠道!
询价
TST
23+
9000
华南总代
询价
MITEQ
100
询价
TST
2016+
SMD
6523
只做进口原装现货!假一赔十!
询价
TST
21+
SMD
12588
全新原装深圳现货
询价
TST
SMD
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
SAWTEK
SMD-10
35560
一级代理 原装正品假一罚十价格优势长期供货
询价
TST
23+
30000
代理全新原装现货,价格优势
询价
TST
21+
200
原装现货假一赔十
询价
更多TB0230A供应商 更新时间2024-5-29 15:00:00