零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
---|---|---|---|---|
ALN0230 | Internally Matched LNA Module | ASB Advanced Semiconductor Business Inc. | ASB | |
ALN0230 | Internally Matched LNA Module | ASB Advanced Semiconductor Business Inc. | ASB | |
Internally Matched LNA Module | ASB Advanced Semiconductor Business Inc. | ASB | ||
Internally Matched LNA Module | ASB Advanced Semiconductor Business Inc. | ASB | ||
SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
FullHDDigitalImageSensor | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
1/2.7-Inch2.1Mp/FullHDDigitalImageSensor | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor | ONSEMION Semiconductor 安森美半导体安森美半导体公司 | ONSEMI | ||
SMDSchottkyBarrierDiode Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold | ANACHIP 易亨易亨电子股份有限公司 | ANACHIP | ||
N-ChannelMOSFETusesadvancedtrenchtechnology | DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD. 杜因特深圳市杜因特半导体有限公司 | DOINGTER | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
详细参数
- 型号:
ALN0230
- 制造商:
ASB
- 制造商全称:
ASB
- 功能描述:
Internally Matched LNA Module
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
ABCO |
2015+ROHS |
AXIAL |
493900 |
一级质量长期可供应量大价格从优 |
询价 | ||
ABCO |
2021+ |
AXIAL |
383800 |
原厂授权代理,海外优势订货渠道。可提供大量库存,详 |
询价 | ||
ASB |
23+ |
原厂原包 |
19960 |
只做进口原装 终端工厂免费送样 |
询价 | ||
PLEROW(ASB) |
23+ |
LNA模块 |
7300 |
专注配单,只做原装进口现货 |
询价 | ||
PLEROW(ASB) |
23+ |
LNA模块 |
7300 |
专注配单,只做原装进口现货 |
询价 |
相关规格书
更多- ALN0332
- ALN0450AT
- ALN0460
- ALN-0600
- ALN06L-G
- ALN06L-R
- ALN06LU-A
- ALN06LU-G
- ALN06LU-S
- ALN0742
- ALN0742WT
- ALN0743AT
- ALN0815
- ALN0836
- ALN0837
- ALN0838
- ALN0839AT
- ALN0859
- ALN0859BT
- ALN0860
- ALN0882AT
- ALN0892R2
- ALN08L-G
- ALN08L-R
- ALN08L-W
- ALN0905
- ALN0925
- ALN0925BT
- ALN-101S/C
- ALN1100
- ALN1100R2
- ALN1101
- ALN1250
- ALN12611-G
- ALN12611-R
- ALN12620-R
- ALN1400
- ALN1465
- ALN1500AT
- ALN1542T2
- ALN1611-R
- ALN1700
- ALN1733
- ALN1747AT
- ALN1750AT
相关库存
更多- ALN0450
- ALN0450WT
- ALN0460WT
- ALN0675WT
- ALN06L-O
- ALN06L-S
- ALN06LU-C
- ALN06LU-R
- ALN06LU-W
- ALN0742AT
- ALN0743
- ALN0810
- ALN0832
- ALN0836AT
- ALN0837AT
- ALN0838AT
- ALN0855
- ALN0859AT
- ALN0859M3
- ALN0878
- ALN0892
- ALN0892T1
- ALN08L-O
- ALN08L-S
- ALN0902AT
- ALN0910
- ALN0925AT
- ALN0926AT
- ALN11
- ALN1100BT
- ALN1100T2
- ALN121208-II
- ALN12602-R
- ALN12611-O
- ALN12611-W
- ALN1280
- ALN1425
- ALN1500
- ALN1502AT
- ALN1585
- ALN1620-G
- ALN1701
- ALN1735T2
- ALN1750
- ALN1750BT