XCV812E-6BG560C

Package：560-LBGA 裸焊盘，金属；包装：托盘 类别：集成电路（IC） FPGA（现场可编程门阵列） 描述：IC FPGA 404 I/O 560MBGA

AMD Xilinx

XCV812E-7BG560C

Package：560-LBGA 裸焊盘，金属；包装：托盘 类别：集成电路（IC） FPGA（现场可编程门阵列） 描述：IC FPGA 404 I/O 560MBGA

AMD Xilinx

XCV812E-8BG560C

Package：560-LBGA 裸焊盘，金属；包装：托盘 类别：集成电路（IC） FPGA（现场可编程门阵列） 描述：IC FPGA 404 I/O 560MBGA

AMD Xilinx

812

Mill-MaxSpring-loadedConnectorsMinimizeNoise

812

efficientandcost-effectivesolutiontowearproblemsontheshaft.

�DESCRIPTION TheBECA810profileisa standardstainlesssteelsleeve. �APPLICATIONS Hubs Pinions Differentials Gearboxes Crankshafts �DESCRIPTION TheBECA811profileisa premiumstainlesssteelsleeve withahardchrometreatment. �APPLICATIONS Hubs Pinions Different

812A

AudioBroadcastQuality800ASeries

Features Deep-drawnsteelcasewithtinplatedfinish,withtwoconvenient6-32mountingstuds withhardware. Includeswireleads(minimumlengthof4). Frequencyresponse+/-0.5dbmax.from50Hz.to15Khz. Insertionlossofapx.1db. Maximumpowerlevel+15dbm.(except841A,842A&84

812H

MiniaturePCBPowerRelays10A250VAC

A812ERW

LowCost,8WDIPWideInputRangeDC/DCConverters

AADG812YRU

0.5CMOS1.65Vto3.6VQuadSPSTSwitches

GENERALDESCRIPTION TheADG811/ADG812/ADG813arelowvoltageCMOSdevicescontainingfourindependentlyselectableswitches.Theseswitchesofferultralowonresistanceoflessthan0.8Ωoverthefull temperaturerange.Thedigitalinputscanhandle1.8Vlogicwitha2.7Vto3.6Vsupply. FE

AD812

Dual,CurrentFeedbackLowPowerOpAmp

PRODUCTDESCRIPTION TheAD812isalowpower,singlesupply,dualvideoamplifier.Eachoftheamplifiershave50mAofoutputcurrentandareoptimizedfordrivingoneback-terminatedvideoload(150Ω)each.Eachamplifierisacurrentfeedbackamplifierandfeaturesgainflatnessof0.1dBt