Wafer Level Processing and Die Processing Services

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amkor

安靠科技

Wafer level packaging applies similar processes as used in front-end wafer processing.

Design Features Chip-first approach with Known Good Die (KGD) from probed front-end wafers Supports all kinds of incoming wafer diameter and chip packaging media Reconstituted wafer (chip embedding in epoxy) Single die and multi-die solutions, possibility of embedded discrete passives Pa

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amkor

安靠科技

32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 8 kB SRAM

General description The LPC1102/1104 are an ARM Cortex-M0 based, low-cost 32-bit MCU, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. Fea

文件：255.61 Kbytes 页数：38 Pages

恩XP

Wafer Level Processing & Die Processing Services (WLP/DPS)

WAFER LEVEL FEATURES 4-196 ball count Small body 0.16 mm2 to large 100.0 mm2 body size Polyimide (PI), PBO, low-cure polymers and Redistribution Layer (RDL) available Electroplated Sn/Ag

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amkor

安靠科技

Package Outline

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GMT

致新科技

Package Outline

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GMT

致新科技

Package Outline

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GMT

致新科技

Package Outline

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GMT

致新科技

Package Outline

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GMT

致新科技

Package Outline

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GMT

致新科技