Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B1

文件：143.07 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (D2PAK (TO-263AB package)) • Solder dip

文件：142.5 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

Ultrafast Rectifier

文件：138.99 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

Ultrafast Rectifier

文件：138.29 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

High Voltage Ultrafast Rectifier

文件：133.27 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世