Infrared Thermopile Sensor with Integrated Math Engine

文件：1.3583 Mbytes 页数：55 Pages

TI

德州仪器

Package：8-UFBGA，DSBGA；包装：卷带（TR） 类别：传感器，变送器 温度传感器 - 模拟和数字输出 描述：SENSOR DIGITAL -40C-125C 8DSBGA

TI2

德州仪器

Infrared Thermopile Sensor with Integrated Math Engine

文件：1.3583 Mbytes 页数：55 Pages

TI

德州仪器

PIM for Gigabit Ethernet XMCs

Application Information The TPIM007 is a PMC I/O Module (PIM) compatible module providing easy access to the XMC back I/O lines of XMC carriers when used on a PIM carrier. The TPIM007 distributes the Ethernet signals of TEWS' Gigabit Ethernet XMC modules with P16 back I/O to RJ45 connectors

文件：238.5 Kbytes 页数：2 Pages

TEWS

Conduction Cooled, 4x 10/100/1000 Mbit/s

Application Information The TXMC385 is a Conduction Cooled Switched Mezzanine Card (CCXMC) compatible module providing a four channel Ethernet 10BASE-T / 100BASE-TX / 1000BASE-T interface. A PCI Express Switch provides access to the Intel™ 82574IT Gigabit Ethernet controllers. Each Ethernet inte

文件：659.89 Kbytes 页数：2 Pages

TEWS