TI60F225C4说明书PDF资料批发供应ETCETC-114ic电子网

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零件编号	下载&订购	功能描述	制造商&上传企业	LOGO
TI60F225C4	文件：969.28 Kbytes Page：70 Pages	DSTi60-v2.0 Features •High-density,low-powerQuantum™computefabric •BuiltonTSMC16nmprocess •10-kbithigh-speed,embeddedSRAM,configurableassingle-portRAM,simpledual-port RAM,truedual-portRAM,orROM •High-performanceDSPblocksformultiplication,addition,subtraction,accumulation	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
TI60F225C4	文件：100 bytes Page：1 Pages	包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带封装/外壳：225-BGA 类别：集成电路（IC） FPGA（现场可编程门阵列）描述：FPGA TITAN 140HSIO 4PLL 225BGA	Efinix, Inc. Efinix, Inc.	Efinix, Inc.
TI60F225C4L	文件：969.28 Kbytes Page：70 Pages	DSTi60-v2.0 Features •High-density,low-powerQuantum™computefabric •BuiltonTSMC16nmprocess •10-kbithigh-speed,embeddedSRAM,configurableassingle-portRAM,simpledual-port RAM,truedual-portRAM,orROM •High-performanceDSPblocksformultiplication,addition,subtraction,accumulation	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
TI60F225C4L	文件：100 bytes Page：1 Pages	包装：托盘封装/外壳：225-BGA 类别：集成电路（IC） FPGA（现场可编程门阵列）描述：FPGA TITAN140HSIO 4PLL LP 225BGA	Efinix, Inc. Efinix, Inc.	Efinix, Inc.

更多TI60F225C4供应商更新时间2024-5-20 15:38:00