首页 >TFM201210GHM>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Moidingpowerlnductors | LEIDITECHShanghai Leiditech Electronic Technology Co., Ltd 雷卯电子上海雷卯电子科技有限公司 | LEIDITECH | ||
MoldingPowerInductors | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | etc2 | ||
MINIMOLDEDPOWERINDUCTOR Features •ShieldedconstructionforminimizedEMI. •LowDCR(aslowas8mΩ)forbetterefficiency •Highcurrentupto14.5Ahandlingcapability. •Compactsizethatissuitableforhigh-densitydesigns •ExcellentforhighfrequencyswitchingapplicationsduetoSRFupto264MHz. Applic | ABRACON Abracon Corporation | ABRACON | ||
Multi-LayerChipInductors | BournsBourns Electronic Solutions 伯恩斯 | Bourns | ||
Multi-LayerChipInductors | BournsBourns Electronic Solutions 伯恩斯 | Bourns | ||
HighCurrentFerriteChipInductor(LeadFree) | TAI-TECHTAI-TECH Advanced Electronics Co., Ltd. 西北台庆科技西北台庆科技股份有限公司 | TAI-TECH | ||
Series-FerriteMulti-LayerChipInductors | BournsBourns Electronic Solutions 伯恩斯 | Bourns | ||
TheuseofFlatwireforLowDCresistance | Toko TOKO, Inc | Toko | ||
FERRITECHIPINDUCTORS | SUPERWORLDSuperworld Electronics 超级世界电子超级世界电子公司 | SUPERWORLD | ||
MULTILAYERCHIPINDUCTOR | ABCABC Taiwan Electronics Corp 千如电子千如电子集团 | ABC |
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