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TMP007

TMP007InfraredThermopileSensorwithIntegratedMathEngine

TITexas Instruments

德州仪器美国德州仪器公司

TMP007

InfraredThermopileSensorwithIntegratedMathEngine

TI1Texas Instruments

德州仪器美国德州仪器公司

TMP-007

TMPThermalPadAccessory

CRANE

Crane Aerospace & Electronics.

TMP007AIYZFR

InfraredThermopileSensorwithIntegratedMathEngine

TI1Texas Instruments

德州仪器美国德州仪器公司

TMP007AIYZFT

InfraredThermopileSensorwithIntegratedMathEngine

TI1Texas Instruments

德州仪器美国德州仪器公司

TPIM007

ConductionCooled,FourChannel10/100/1000Mbit/sEthernet

ApplicationInformation TheTXMC395isaConductionCooledSwitched MezzanineCard(CCXMC)compatiblemoduleprovidinga fourchannelEthernet10Base-T/100Base-TX/ 1000Base-Tinterface. APCIeSwitchprovidesaccesstotheIntelI210ITGigabit Ethernetcontrollers.EachEthernetinterface

TEWS

TEWS Technologies GmbH

TPIM007

ConductionCooled,4x10/100/1000Mbit/s

ApplicationInformation TheTXMC385isaConductionCooledSwitchedMezzanineCard(CCXMC)compatiblemoduleprovidingafourchannelEthernet10BASE-T/100BASE-TX/1000BASE-Tinterface. APCIExpressSwitchprovidesaccesstotheIntel™82574ITGigabitEthernetcontrollers.EachEthernetinte

TEWS

TEWS Technologies GmbH

TPIM007

PIMforGigabitEthernetXMCs

ApplicationInformation TheTPIM007isaPMCI/OModule(PIM)compatible moduleprovidingeasyaccesstotheXMCbackI/Olines ofXMCcarrierswhenusedonaPIMcarrier. TheTPIM007distributestheEthernetsignalsofTEWS' GigabitEthernetXMCmoduleswithP16backI/OtoRJ45 connectors

TEWS

TEWS Technologies GmbH

TPIM007-DOC

PIMforGigabitEthernetXMCs

ApplicationInformation TheTPIM007isaPMCI/OModule(PIM)compatible moduleprovidingeasyaccesstotheXMCbackI/Olines ofXMCcarrierswhenusedonaPIMcarrier. TheTPIM007distributestheEthernetsignalsofTEWS' GigabitEthernetXMCmoduleswithP16backI/OtoRJ45 connectors

TEWS

TEWS Technologies GmbH

TSM007

PrimaryPWMController

DESCRIPTION TheTSM007integratedcircuitincorporatesallcircuitrytoimplementofflineorDC-DCpowersupplyapplicationsusingafixedfrequencycurrentmodecontrol. BasedonastandardcurrentmodePWMcontroller,thisdeviceincludesadditionalfeaturesforhigherintegration. ■Current

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体集团

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