1.3 Mega pixel sensor chip

文件：284.45 Kbytes 页数：30 Pages

TOSHIBA

东芝

1.3 Mega pixel sensor chip

Toshiba

东芝

High Performance PowerPC based IndustryPack® Carrier

Application Information The TVME8240 VMEbus CPU board is based on the high integrated MPC8240 Power PC microprocessor with an MPC603e CPU core, a powerful DRAM controller and PCI interface. The TVME8240 provides 4 IndustryPack slots with front I/O, NVRAM/RTC, Fast Ethernet, and FLASH memory. Th

文件：114.55 Kbytes 页数：2 Pages

TEWS

High Performance PowerPC based IndustryPack® Carrier

Application Information The TVME8240A VMEbus CPU board is based on the high integrated MPC8245 Power PC microprocessor with an MPC603e CPU core, a powerful Memory controller and PCI interface. The TVME8240A provides 4 IndustryPack slots with front I/O, NVRAM/RTC, Fast Ethernet, and FLASH memory.

文件：220.92 Kbytes 页数：2 Pages

TEWS

High Performance PowerPC based IndustryPack® Carrier

Application Information The TVME8240A VMEbus CPU board is based on the high integrated MPC8245 Power PC microprocessor with an MPC603e CPU core, a powerful Memory controller and PCI interface. The TVME8240A provides 4 IndustryPack slots with front I/O, NVRAM/RTC, Fast Ethernet, and FLASH memory.

文件：220.92 Kbytes 页数：2 Pages

TEWS