SRP300A_V01中文资料威世科技数据手册PDF规格书

FEATURES

• Glass passivated chip junction

• Fast switching for high efficiency

• Low forward voltage drop

• Low leakage current

• High forward surge capability

• Solder dip 275 °C max. 10 s, per JESD 22-B106

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

For use in fast switching rectification of power supply,

inverters, converters and freewheeling diodes for consumer

and telecommunication.

Note

• These devices are not AEC-Q101 qualified.

MECHANICAL DATA

Case: DO-201AD, molded epoxy body

Molding compound meets UL 94 V-0 flammability rating

Base P/N-E3 - RoHS-compliant, commercial grade

Terminals: Matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

E3 suffix meets JESD 201 class 1A whisker test

Polarity: Color band denotes cathode end