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SN75976A1DGG.A中文资料德州仪器数据手册PDF规格书

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厂商型号

SN75976A1DGG.A

功能描述

9-CHANNEL DIFFERENTIAL TRANSCEIVER

丝印标识

SN75976A1

封装外壳

TSSOP

文件大小

960.41 Kbytes

页面数量

39

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-11-14 20:00:00

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SN75976A1DGG.A价格和库存,欢迎联系客服免费人工找货

SN75976A1DGG.A规格书详情

Improved Speed and Package Replacement

for the SN75LBC976

Designed to Operate at up to 20 Million

Data Transfers per Second (Fast-20 SCSI)

Nine Differential Channels for the Data and

Control Paths of the Small Computer

Systems Interface (SCSI) and Intelligent

Peripheral Interface (IPI)

SN75976A Packaged in Shrink

Small-Outline Package with 25-Mil Terminal

Pitch (DL) and Thin Shrink Small-Outline

Package with 20-Mil Terminal Pitch (DGG)

SN55976A Packaged in a 56-Pin Ceramic

Flat Pack (WD)

Two Skew Limits Available

ESD Protection on Bus Terminals

Exceeds 12 kV

Low Disabled Supply Current 8 mA Typ

Thermal Shutdown Protection

Positive- and Negative-Current Limiting

Power-Up/Down Glitch Protection

description

The SN75976A is an improved replacement for

the industry’s first 9-channel RS-485

transceiver — the SN75LBC976. The A version

offers improved switching performance, a smaller

package, and higher ESD protection. The

SN75976A is offered in two versions. The ’976A2

skew limits of 4 ns for the differential drivers and

5 ns for the differential receivers complies with the

recommended skew budget of the Fast-20 SCSI

standard for data transfer rates up to 20 million

transfers per second. The ’976A1 supports the

Fast SCSI skew budget for 10 million

transfers per second. The skew limit ensures that the propagation delay times, not only from channel-to-channel

but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel

data buses.

The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976

have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even

less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more

board area and allows component mounting to both sides of the printed circuit boards for low-profile,

space-restricted applications such as small form-factor hard disk drives.

供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
24+
NA/
3309
原厂直销,现货供应,账期支持!
询价
TI
20+
NA
53650
TI原装主营-可开原型号增税票
询价
TI
23+
TSSOP
50000
只做原装正品
询价
TI/TEXAS
NEW
原厂封装
8931
代理全系列销售, 全新原装正品,价格优势,长期供应,量大可订
询价
TI
25+
TSSOP
59
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
TI
2025+
TSSOP
5185
全新原厂原装产品、公司现货销售
询价
TI
25+23+
56-TSSOP
13106
绝对原装正品全新进口深圳现货
询价
TI
22+
56TSSOP
9000
原厂渠道,现货配单
询价
TI/德州仪器
24+
TSSOP
33487
郑重承诺只做原装进口现货
询价
TI
17+
TSSOP
6200
100%原装正品现货
询价