3-Level TNPC

Features* • Optimized design for superior thermal performances • Low inductive design • Press-Fit contact technology • 1200V Trench IGBT4 Fast (F4) • 650V Trench IGBT3 (E3) • Robust and soft switching CAL4F diode technology • Integrated NTC temperature sensor • UL recognized file no. E 6

文件：1.2142 Mbytes 页数：9 Pages

Semikron

赛米控丹佛斯

IGBT模块

• Optimized design for superior thermal performance\n• Low inductive design\n• Press-Fit contact technology\n• 1200V Trench IGBT4 Fast (F4)\n• 650V Trench IGBT3 (E3)\n• Robust and soft switching CAL4F diode technology\n• Integrated NTC temperature sensor\n• UL recognized file no. E 63 532;

Semikron-DANFOSS

赛米控丹佛斯

MCC
SMA(DO-214AC)

MCC

上传：北京京北通宇电子元件有限公司

MIC
SMB

MIC

昌福电子

上传：深圳市讯运电子有限公司

MDD
SMB (DO-214)

MDD

上传：北京贝诺电子科技发展有限公司