SoC

Qualcomm® SiRFstar™ IV GSD4e B03 WLCSP is a comprehensive navigation processor built on a low-power RF CMOS single-die, incorporating the baseband, integrated navigation solution, software, ARM®7 processor, and RF functions that are designed to form a complete internal ROM-based standalone or Aided- • Location\n• CPU\n• Interface\n• Package\n - Package Size: 3.5 x 3.2 x 0.6 mm\n - Package Type: WLCSP\n - Pitch: 0.5mm Pitch;

Qualcomm

高通

SoC

Qualcomm® SiRFstar™ V 5e B02 can get fast location fixes for geo-tagging images or videos, asset tracking and fitness applications. Advanced low power technologies are designed to allow the 5e to deliver high performance while saving power. The SiRFstar V family of products feature support for track • Location\n• Memory\n• Interface\n• Input/Output\n• Package\n - Package Type: BGA, WLCSP\n - Pitch: 0.4mm Pitch, 0.5mm Pitch\nGalileo readyExternal RAM on WLCSP, Stacked on BGAWLCSPBGA;

Qualcomm

高通

SoC

Qualcomm® SiRFstar™ V 5ea is automotive qualified and offers high performance in sensitivity, TTFF, urban canyon availability and accuracy. Paired with Dead Reckoning technology, the 5ea is engineered to provide uninterrupted positioning in the most challenging automotive environments including dens • Location\n• Memory\n• Interface\n• Input/Output\n• Operating Temperature Range\n• Package\n - Package Type: BGA\n - Package Size: 7 x 10 x 1.2 mm\n - Pitch: 0.8mm Pitch\nExternal Memory;

Qualcomm

高通

BGA

SiS

矽统科技

上传：深圳庞田科技有限公司

PowerPAK1212-8

VISHAY(威世)

上传：深圳市星宇佳科技有限公司