Surface Mount Super Fast Recovery Rectifiers

Features: * Plastic package has Underwriters Laboratory Flammability. Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. * For surface mounted applications. * Exceeds environmental standards of MIL-S-19500 / 228. * Low leakage current.

文件：210.23 Kbytes 页数：3 Pages

WEITRON

Super fast recovery type

1.0A Surface Mount Super Fast Rectifiers-50-600V Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • High current capability. • S

文件：69.38 Kbytes 页数：2 Pages

FORMOSA

美丽微半导体

SMA

Features • Plastic package has Underwr94V-O Utilizing Flame RetardantEpoxy Molding Compoiters Laboratory FlammabilityClassification und. • For surface mounted applications. • Exceeds environmental standards of MIL-S-19500 / 228 • Low leakage current.

文件：113.41 Kbytes 页数：2 Pages

WINNERJOIN

永而佳

Plastic package has Underwriters Laboratory

文件：113.41 Kbytes 页数：2 Pages

WINNERJOIN

永而佳

SURFACE MOUNT FAST RECOVERY RECTIFIER

文件：103.05 Kbytes 页数：6 Pages

RECTRON

丽正国际

Chip Super Fast Rectifier

文件：58.58 Kbytes 页数：7 Pages

FORMOSA

美丽微半导体

Chip Silicon Rectifier - Super fast recovery type

1.0A Surface Mount Super Fast Rectifiers-50-600V Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • High current capability. • High surge curre

文件：80.3 Kbytes 页数：2 Pages

FORMOSA

美丽微半导体

1A SURFACE MOUNT SUPER FAST RECOVERY RECTIFIERS

FEATURES ● FOR SURFACE MOUNTED APPLICATIONS ● LOW PROFILE PACKAGE ● BUILT-IN STRAIN RELIEF ● EASY PICK AND PLACE ● PLASTIC MATERIAL USED CARRIES UNDERWRITERS LABORATORY CLASSIFICATION 94 V-0 ● SUPER FAST SWITCHING ● GLASS PASSIVATED CHIP JUNCTION ● HIGH TEMPERATURE SOLDERING: 250°C/10 SECO

文件：64.239 Kbytes 页数：2 Pages

FRONTIER

Super fast recovery type

Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • High current capability. • Superfast recovery time for switching

文件：70.15 Kbytes 页数：2 Pages

FORMOSA

美丽微半导体

SUPER FAST RECOVER TYPE

FEATURES • Plastic package has Underwriters Laboratory • Flammability classification 94V-0 Utilizing Fame • Retardant Epoxy Molding Compound • For surface mount applications • Exceeds environmental standards of MIL-S-19500/228 • Low leakage current.

文件：524.59 Kbytes 页数：2 Pages

PACELEADER

霈峰