SE2623L-R: 2.4 GHz High Power Wireless LAN Power Amplifier

Applications  DSSS 2.4 GHz WLAN (IEEE 802.11b)  OFDM 2.4 GHz WLANs:  IEEE 802.11b/g/n  256 QAM IEEE 802.11ac  Access points  PCMCIA cards  PC cards Features  Single 5 V supply operation: +23 dBm, EVM = 1.8 %, MCS8 +26 dBm, EVM = 3 %, 802.11g, OFDM 54 Mbps +26 dBm, ACPR

文件：1.44568 Mbytes 页数：12 Pages

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SE2623L-R: 2.4 GHz High Power Wireless LAN Power Amplifier

Applications  DSSS 2.4 GHz WLAN (IEEE 802.11b)  OFDM 2.4 GHz WLANs:  IEEE 802.11b/g/n  256 QAM IEEE 802.11ac  Access points  PCMCIA cards  PC cards Features  Single 5 V supply operation: +23 dBm, EVM = 1.8 %, MCS8 +26 dBm, EVM = 3 %, 802.11g, OFDM 54 Mbps +26 dBm, ACPR

文件：1.44568 Mbytes 页数：12 Pages

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2.4 GHz High-Power Wireless LAN Power Amplifier

文件：187.76 Kbytes 页数：2 Pages

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2.4 GHz High-Power Wireless LAN Power Amplifier

文件：187.76 Kbytes 页数：2 Pages

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2.4 GHz Power Amplifiers for Wi-Fi Connectivity

The SE2623L is a 2.4 GHz power amplifier designedfor use in the 2.4 GHz ISM band for wireless LANapplications. The device incorporates a powerdetector for closed loop monitoring of the outputpower.\n\nThe SE2623L includes a digital enable control fordevice on/off control.\n\nThe SE2623L temperature • Single 5 V Supply Operation - 23 dBm, EVM = 1.8 %, MCS9 - 26 dBm, EVM = 3 %, 802.11g, OFDM 54 Mbps - 26 dBm, ACPR < -32 dBc, 802.11b\n• 33 dB Gain\n• Integrated temperature compensated power detector\n• Digital power amplifier enable pin (VEN)\n• Lead Free, Halogen Free and RoHS compliant\;

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2.4 GHz High-Power Wireless LAN Power Amplifier

The SE2623L-R is a 2.4 GHz power amplifier (PA) designed foruse in the 2.4 GHz Industrial, Scientific, Medical (ISM) band forwireless local area network (LAN) applications. The SE2623L-Rdevice incorporates a power detector for closed loop monitoringof the output power.\n\nThe SE2623L-R includes a di • High linear output power for IEEE 802.11ac, MCS9, 5 V\n• Integrated temperature-compensated power detector\n• Small QFN (16-pin, 3.0 x 3.0 x 0.9 mm) package (MSL3, 260 °C per JEDEC J-STD-020);

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包装：散装 类别：开发板，套件，编程器 射频评估和开发套件，开发板 描述：EVALUATION BOARD SE2623L-R

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Package：16-VFQFN 裸露焊盘；包装：带 类别：RF/IF，射频/中频和 RFID 射频放大器 描述：IC AMP 802.11B/G/N 2.4GHZ 16QFN

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Package：16-VFQFN 裸露焊盘；包装：盒 类别：RF/IF，射频/中频和 RFID 射频放大器 描述：IC RF POWER AMP 2.4GHZ 16QFN

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