| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
S1020 | 异构多核架构SoC芯片 异构多核架构SoC芯片目前目前可提供样片,该芯片兼顾传统算法与人工智能算法的通用化处理平台。DSP内核提供强大的算力,满足传统算法的计算需求;AI核提供人工智能算法处理能力。 | FDMTEK 中科本原 | FDMTEK | |
S1020 | 高性能嵌入式64位处理器芯片 S1020高性能嵌入式64位处理器采用C9800架构的双核PowerPC处理器,具备DDR3/4控制器、数据通路加速模块(DPAA)、硬件加速安全引擎、PCIE接口、SATA接口、USB3.0接口、以及常规的SPI、UART等接口。包含了网络互联、电信/数据通信和无线基础设施应用所需要的高性能数据通路接口逻辑、网络以及外设等总线接口。\n\n该芯片可用于路由器、交换机、基站控制器和通用嵌入式计算中的综合控制、数据通路和应用层处理。与多台分立器件相比,它的高度集成提供了显著的性能优势,同时也大大简化了电路板的设计。\n\nS1020对标芯片为NXP T1022。\n\nS1020芯片设计、生产加 • C9800内核:兼容NXP 64位PowerPC e5500核\n• 存储资源:512KB SRAM\n• 支持64位带ECC DDR3L/DDR4\n• 数据路径加速架构(DPAA)\n• 硬件加速安全引擎\n\n☆ 支持PKHA、DESA、AESA、MDHA、随机数发生器;\n\n☆ 支持RSA和DH、椭圆曲线密码、DES/3DES、AES、SHA/MD5/HMAC、CRC单元、随机数发生器,包括真随机数引擎,4路独立时钟;SM1、SM4、SSF33、AES、DES、3DES等对称算法加速引擎; | Core 苏州国芯 C | Core | |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. Operating the back-thinned CCD in TDI mode delivers high sensitivity. TDI-CCD captures clear and bright images even under low-light-level conditions. During TDI mode, the CCD captures an image of a moving object while transferring integrated signal charges synchronously with the object movement. 文件:232.11 Kbytes 页数:11 Pages | HAMAMATSUHamamatsu Photonics Co.,Ltd. 滨松光子滨松光子学株式会社 | HAMAMATSU | ||
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. Operating the back-thinned CCD in TDI mode delivers high sensitivity. TDI-CCD captures clear and bright images even under low-light-level conditions. During TDI mode, the CCD captures an image of a moving object while transferring integrated signal charges synchronously with the object movement. 文件:232.11 Kbytes 页数:11 Pages | HAMAMATSUHamamatsu Photonics Co.,Ltd. 滨松光子滨松光子学株式会社 | HAMAMATSU | ||
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. Operating the back-thinned CCD in TDI mode delivers high sensitivity. TDI-CCD captures clear and bright images even under low-light-level conditions. During TDI mode, the CCD captures an image of a moving object while transferring integrated signal charges synchronously with the object movement. 文件:232.11 Kbytes 页数:11 Pages | HAMAMATSUHamamatsu Photonics Co.,Ltd. 滨松光子滨松光子学株式会社 | HAMAMATSU | ||
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. Operating the back-thinned CCD in TDI mode delivers high sensitivity. TDI-CCD captures clear and bright images even under low-light-level conditions. During TDI mode, the CCD captures an image of a moving object while transferring integrated signal charges synchronously with the object movement. 文件:232.11 Kbytes 页数:11 Pages | HAMAMATSUHamamatsu Photonics Co.,Ltd. 滨松光子滨松光子学株式会社 | HAMAMATSU | ||
SCRs 1-70 AMPS NON-SENSITIVE GATE Features ● Electrically Isolated Packages ● High Voltage Capability - 30 - 600 Volts ● High Surge Capability - up to 950 Amps ● Glass Passivated Chip 文件:1.60012 Mbytes 页数:12 Pages | Teccor | Teccor | ||
TDI-CCD image sensors 文件:855.61 Kbytes 页数:14 Pages | HAMAMATSUHamamatsu Photonics Co.,Ltd. 滨松光子滨松光子学株式会社 | HAMAMATSU | ||
Slide Switches 文件:340.55 Kbytes 页数:5 Pages | CK-COMPONENTS 力特 | CK-COMPONENTS | ||
S Series Slide Switches 文件:339.22 Kbytes 页数:5 Pages | CK-COMPONENTS 力特 | CK-COMPONENTS |
技术参数
- 像素尺寸:
12 x 12 μm
- 像素间距:
12 μm
- 有效像素个数:
1024 x 128 pixels
- 封装:
陶瓷
- 帧速率(典型值):
50KHz
- 光谱响应范围:
200to 1100nm
- 饱和电荷量(典型值):
100 ke-
- 暗电流(典型值):
30 e-/pixel
- 读出噪声(典型值):
35 e- rms
- 测试条件:
TA = 25℃
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
INFINEON |
03/04+ |
TQFP48 |
35 |
全新原装100真实现货供应 |
询价 | ||
24+ |
20 |
询价 | |||||
Infineon |
25+ |
TQFP48 |
2978 |
100%全新原装公司现货供应!随时可发货 |
询价 | ||
C&KComponents |
新 |
55 |
全新原装 货期两周 |
询价 | |||
C&K |
24+ |
SMD |
90000 |
一级代理商进口原装现货、假一罚十价格合理 |
询价 | ||
C&KComponent |
23+ |
65480 |
询价 | ||||
C&K Components |
2022+ |
51 |
全新原装 货期两周 |
询价 | |||
HAMAMATSU |
2447 |
CCD |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
询价 | ||
C&K |
25+ |
开关元件 |
2896 |
就找我吧!--邀您体验愉快问购元件! |
询价 | ||
C&K |
2021+ |
- |
499 |
询价 |
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