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RS5

SILICON BRIDGE RECTIFIERS

文件:47.33 Kbytes 页数:2 Pages

HY

虹扬科技

RS5A

丝印:RS5A;Package:SMC;FAST RECOVERY RECTIFIERS

Features ● Ultrafast reverse recovery time ● Low leakage current ● Low switching losses, high efficiency ● High forward surge capability ● Solder dip 260°C max. 10 s, per JESD 22-B106

文件:1.86174 Mbytes 页数:3 Pages

SAMYANG

三阳电子

RS5AB

丝印:RS5A;Package:SMB;Surface Mount Fast Recovery Rectifiers

Features For surface mounted applications Low profile package Glass passivated chip junction Easy to pick and place Fast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件:2.3225 Mbytes 页数:4 Pages

UNSEMI

优恩半导体

RS5AC

丝印:RS5A;Package:SMC;Surface Mount Fast Recovery Rectifiers

Features For Surface Mounted Applications Low Profile Package Glass passivated chip junction Easy to Pick and Place Fast Reverse Recovery Time Lead Free in Comply with EU RoHS 2011/65/EU Directives

文件:2.33331 Mbytes 页数:4 Pages

UNSEMI

优恩半导体

RS5B

丝印:RS5B;Package:SMC;FAST RECOVERY RECTIFIERS

Features ● Ultrafast reverse recovery time ● Low leakage current ● Low switching losses, high efficiency ● High forward surge capability ● Solder dip 260°C max. 10 s, per JESD 22-B106

文件:1.86174 Mbytes 页数:3 Pages

SAMYANG

三阳电子

RS5BB

丝印:RS5B;Package:SMB;Surface Mount Fast Recovery Rectifiers

Features For surface mounted applications Low profile package Glass passivated chip junction Easy to pick and place Fast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件:2.3225 Mbytes 页数:4 Pages

UNSEMI

优恩半导体

RS5BC

丝印:RS5B;Package:SMC;Surface Mount Fast Recovery Rectifiers

Features For Surface Mounted Applications Low Profile Package Glass passivated chip junction Easy to Pick and Place Fast Reverse Recovery Time Lead Free in Comply with EU RoHS 2011/65/EU Directives

文件:2.33331 Mbytes 页数:4 Pages

UNSEMI

优恩半导体

RS5D

丝印:RS5D;Package:SMC;FAST RECOVERY RECTIFIERS

Features ● Ultrafast reverse recovery time ● Low leakage current ● Low switching losses, high efficiency ● High forward surge capability ● Solder dip 260°C max. 10 s, per JESD 22-B106

文件:1.86174 Mbytes 页数:3 Pages

SAMYANG

三阳电子

RS5DB

丝印:RS5D;Package:SMB;Surface Mount Fast Recovery Rectifiers

Features For surface mounted applications Low profile package Glass passivated chip junction Easy to pick and place Fast reverse recovery time Lead free in comply with EU RoHS 2011/65/EU directives

文件:2.3225 Mbytes 页数:4 Pages

UNSEMI

优恩半导体

RS5DC

丝印:RS5D;Package:SMC;Surface Mount Fast Recovery Rectifiers

Features For Surface Mounted Applications Low Profile Package Glass passivated chip junction Easy to Pick and Place Fast Reverse Recovery Time Lead Free in Comply with EU RoHS 2011/65/EU Directives

文件:2.33331 Mbytes 页数:4 Pages

UNSEMI

优恩半导体

技术参数

  • MaxForwardCurrent:

    5.0A

  • MaxForwardVoltage:

    1.1V

  • PeakForwardSurgeCurrent:

    200A

  • OperatingTemperature:

    -55 ~ 150 °C

  • Package/Case:

    RS5

  • Applications:

    General Purpose

  • MountingType:

    Through Hole

  • RatingforFusing:

    10 A2sec

  • ReverseCurrent@25?C:

    10uA

  • ThermalResistance:

    50 °C/W

  • JunctionCapacitance:

    24.0pF

  • IsolationVoltage:

  • Features:

    Flammability Classification 94V-0

  • Ratings:

    UL E223027

  • Series:

    RS5

  • Packaging:

    Bulk

  • PartStatus:

    Active

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17+
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6200
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25+
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18000
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200
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08+
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66688
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更多RS5供应商 更新时间2025-10-6 9:31:00