首页 >RCC0503KJ>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
RailClamp짰TVSArrayforUSBOTGInterfaces | SEMTECHSemtech Corporation 升特 | SEMTECH | ||
RailClamp짰TVSArrayforUSBOTGInterfaces | SEMTECHSemtech Corporation 升特 | SEMTECH | ||
RailClamp짰TVSArrayforUSBOTGInterfaces | SEMTECHSemtech Corporation 升特 | SEMTECH | ||
RailClamp짰TVSArrayforUSBOTGInterfaces | SEMTECHSemtech Corporation 升特 | SEMTECH | ||
RailClamp짰LowCapacitanceTVSDiodeArray Description TheRailClamp®seriesisafamilyofultralowcapacitanceTVSarraysdesignedtoprotecthighspeeddatainterfaces.Thisserieshasbeenspecificallydesignedtoprotectsensitivecomponentswhichareconnectedtohigh-speeddataandtransmissionlinesfromovervoltagecausedbyESD | SEMTECHSemtech Corporation 升特 | SEMTECH | ||
RailClamp짰LowCapacitanceTVSDiodeArray Description TheRailClamp®seriesisafamilyofultralowcapacitanceTVSarraysdesignedtoprotecthighspeeddatainterfaces.Thisserieshasbeenspecificallydesignedtoprotectsensitivecomponentswhichareconnectedtohigh-speeddataandtransmissionlinesfromovervoltagecausedbyESD | SEMTECHSemtech Corporation 升特 | SEMTECH | ||
Alumina Features: ♦Aluminamaterial ♦1/4Wrap ♦.15Wattinputpower GeneralDescription: TheRK0503ZZ-XXXXWN-AAseriesisa quarterwrapstylechipresistor.Ithasaninput powerof.15Wattswhilemaintainingamounting surfacetemperatureof100°C.Itoffersasmall packagedesignavailab | BARRY Vishay Barry | BARRY | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. •ThinUltrasmallResinPackage(TURP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS |
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