RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：4.66437 Mbytes 页数：485 Pages

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RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capa

文件：4.52117 Mbytes 页数：471 Pages

RENESAS

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RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capa

文件：4.52117 Mbytes 页数：471 Pages

RENESAS

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16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C /Tiny SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using a R8C Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, it

文件：1.79142 Mbytes 页数：198 Pages

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RENESAS MCU R8C FAMILY / R8C/2x SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte ofaddress space, it is c

文件：4.8906 Mbytes 页数：501 Pages

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MCU

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capabl

文件：479.65 Kbytes 页数：52 Pages

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MCU

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capabl

文件：479.65 Kbytes 页数：52 Pages

RENESAS

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RENESAS MCU R8C FAMILY / R8C/2x SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capabl

文件：5.36222 Mbytes 页数：549 Pages

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SINGLE-CHIP 16-BIT CMOS MCU

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. Wit

文件：518.65 Kbytes 页数：59 Pages

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SINGLE-CHIP 16-BIT CMOS MCU

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. Wit

文件：518.65 Kbytes 页数：59 Pages

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