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QSC6270

Single-chip solution for HSDPA and WCDMA (UMTS) networks

Qualcomm

高通

SG-BGA-6270

Ball guide prevents over compression of elastomer

文件:87.84 Kbytes 页数:3 Pages

IRONWOOD

TLE6270R

Quad Low Side Injector Driver

文件:667.96 Kbytes 页数:35 Pages

Infineon

英飞凌

UCYW6270MHD

ALUMINUM ELECTROLYTIC CAPACITORS

High ripple current and Long Life product withstanding load life of 10000 to 12000 hours at +105°C. Suited for power supply and ballast application. Compliant to the RoHS directive (2011/65/EU,(EU) 2015/863). AEC-Q200 Qualified. Please contact us for details.

文件:712.04 Kbytes 页数:6 Pages

nichicon

尼吉康

QSC6270

QUALCOMM
BGA

详细参数

  • 型号:

    QSC6270

  • 制造商:

    QUALCOMM

  • 制造商全称:

    QUALCOMM

  • 功能描述:

    Single-Chip Solution

供应商型号品牌批号封装库存备注价格
QUALCOMM/高通
21+
BGA
20000
原装现货假一罚十
询价
QUALCOMM
15+
BGA
293
全新原装
询价
QUALCOMM
24+
BGA
9860
一级代理/全新现货/长期供应!
询价
QUALCOMM
23+
BGA
25030
主营品牌深圳百分百原装现货假一罚十绝对价优
询价
QUALCOMM/高通
24+
BGA
20
只做原厂渠道 可追溯货源
询价
QUALCOM
24+
BGA
23000
免费送样原盒原包现货一手渠道联系
询价
QUALCOMM
24+
BGA
5000
绝对进口原装,低价现货
询价
Qualcomm
25+
TSSOP30
18000
原厂直接发货进口原装
询价
QUALCOM
2020+
BGA
152
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
Qualcomm
23+
BGA
5000
原装正品,假一罚十
询价
更多QSC6270供应商 更新时间2025-8-27 10:11:00